Packaging Substrate Engineer jobs in United States
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Apple · 19 hours ago

Packaging Substrate Engineer

positionSan Francisco, CA
timeFull-time
remoteOnsite
senioritySenior Level, Lead/Staff
money$181K/yr - $318K/yr
date8+ years exp

Apple's Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for its consumer electronic products. In this role, you will drive sophisticated package selection and work with cross-functional teams to optimize package performance.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Lead SoC package substrate technology development, pathfinding, and roadmap definition
Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM
Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions
Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap
Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc
Problem solving of technical issues during the full product development cycle

Qualification

Substrate technologyManufacturing processProject managementMaterial engineeringCadence Allegro toolsCommunication skillsCollaborative skills

Required

MS or Ph.D. and 8+ years of relevant industry experience
Proven fundamentals in material/chemistry/mechanical engineering field(s)
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc
Exceptional technology development & project management skills
Strong communication & collaborative skills

Preferred

Familiarity with package assembly and integration process preferred
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM)

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple

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Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
dateFounded in 1976
location
Cupertino, California, USA
people-size10001+ employees
web-link
https://www.apple.com

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

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Tim Cook
CEO
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Craig Federighi
SVP, Software Engineering

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Company data provided by crunchbase