Silicon Photonics & Optical Packaging Eng jobs in United States
cer-icon
Apply on Employer Site
company-logo

Apple · 1 day ago

Silicon Photonics & Optical Packaging Eng

positionSan Francisco, CA
timeFull-time
remoteOnsite
senioritySenior Level
money$181K/yr - $318K/yr
date5+ years exp

Apple is seeking a hardworking and passionate Silicon Photonics & Optical Packaging Engineer to join their team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies while leading the Si photonics packaging technology development with cross-functional teams.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL
Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements
Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs
Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development

Qualification

Silicon photonics packagingOptical coupling designOptical packaging architectureLumericalZemaxCOMSOLFiber-coupled devicesCMOS BEOL processingOptics fundamentalsDevice/module integrationTeamworkCommunication skills

Required

Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL
Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements
Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs
Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development
Minimum 5% International travel

Preferred

M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred
Excellent teamwork and communication skills
Strong theoretical background in optics and photonics fundamentals, device/module integration
Hands-on experience in packaging and measuring fiber-coupled devices
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool
Min. 5 years works experiences in the related field with M.S and or Ph.D
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …)
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple

twittertwittertwitter
Glassdoor4.2
company-logo
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
dateFounded in 1976
location
Cupertino, California, USA
people-size10001+ employees
web-link
https://www.apple.com

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

leader-logo
Tim Cook
CEO
leader-logo
Craig Federighi
SVP, Software Engineering

Recent News

Venrock
Venrock Portfolio
2025-12-01
IndiaTimes
Apple TV+ pulls Jessica Chastain’s "The Savant" just days before premiere
2025-09-25
Mac Daily News
Jessica Chastain: I respect Apple’s decision to pause the release of ‘The Savant’ or something
2025-09-25
Company data provided by crunchbase