Hardware Engineering Technical Leader jobs in United States
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Cisco · 2 hours ago

Hardware Engineering Technical Leader

Cisco is a technology company revolutionizing how data and infrastructure connect and protect organizations. The Hardware Engineering Technical Leader will develop and optimize advanced hardware technologies, collaborating closely with various teams to influence reliability and performance across programs.

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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Develop and apply novel simulation and experimental methods to enable and optimize advanced hardware technologies. This includes scalable multiphysics models to predict system-level performance, reliability, and manufacturability (e.g., solder joint reliability, warpage, TIM behavior)
Design and execute DOEs/test vehicles and computational analyses to establish design guidelines and optimize material, geometry, and architecture
Evaluate tradeoffs across performance, reliability, and manufacturability using modeling and analysis
Collaborate with academia and industry partners; contribute to standards bodies, conferences, IP development, and peer-reviewed publications

Qualification

Numerical analysisAdvanced packaging technologyMechanical designAdvanced simulation toolsReliability testing2.5D/3D advanced packagingJEDECIPC standardsCross-functional collaboration

Required

MS or PhD in Mechanical Engineering, Civil Engineering, Solid Mechanics, or Materials Science
10+ years of experience in numerical analysis (e.g., FEA, CFD, coupled field analysis) and advanced packaging technology development
Strong background in mechanical design, reliability, and simulation of complex packaging structures, with a deep understanding of component- and board-level failure modes (e.g., warpage, CTE mismatch, delamination, fatigue)
Proficiency in advanced simulation tools such as ANSYS Mechanical, Multiphysics, and Flotherm, with a track record of validating models through experimental methods
Demonstrated expertise in reliability testing, lifetime prediction methodologies, and characterization of real-world use conditions

Preferred

Experience with 2.5D/3D advanced packaging, heterogeneous integration, and emerging microelectronics technologies
Knowledge of JEDEC or IPC standards related to reliability and thermal/mechanical testing
Strong cross-functional collaboration skills with experience working closely with design, manufacturing, and research teams

Benefits

Medical, dental and vision insurance
A 401(k) plan with a Cisco matching contribution
Paid parental leave
Short and long-term disability coverage
Basic life insurance
10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
Paid year-end holiday shutdown
4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
Cisco’s flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
80 hours of sick time off provided on hire date and each January 1st thereafter
Up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer
Annual bonuses subject to Cisco’s policies

Company

Cisco develops, manufactures, and sells networking hardware, telecommunications equipment, and other technology services and products. It is a sub-organization of Cisco Press.

H1B Sponsorship

Cisco has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1238)
2024 (1231)
2023 (1273)
2022 (2127)
2021 (1991)
2020 (1173)

Funding

Current Stage
Public Company
Total Funding
unknown
1990-02-13IPO

Leadership Team

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Chuck Robbins
Chair and CEO
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Carl Solder
Chief Technology Officer - Cisco System Australia/New Zealand
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Company data provided by crunchbase