Texas Instruments · 8 hours ago
Digital IC Design Engineering Intern
Dallas, TX
Internship
Onsite
InternTexas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. The Digital IC Design Engineering intern will architect new products, define design specifications, and work on various exciting areas including audio and automotive.
ComputerDSPSemiconductor
No H1B
Responsibilities
Partnering with business teams and system engineering to develop mutually agreeable design specifications
Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost
Participating in design reviews and creating the necessary design and product documentation
Partnering on IC layouts to ensure a high-performance standard
Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases
Driving behavioral models
Qualification
Required
Currently pursuing a Masters degree in Electrical Engineering, Electronics Technology, Computer Engineering, Electrical Engineering Technology, Electrical and Computer Engineering or related field
Cumulative 3.0/4.0 GPA or higher
Preferred
Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
Strong verbal and written communication skills
Ability to quickly ramp on new systems and processes
Demonstrated strong interpersonal, analytical and problem-solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-16
The Motley Fool
2026-01-16
2026-01-16
Company data provided by crunchbase