Senior IC Packaging Engineer jobs in United States
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Axiado Corporation · 14 hours ago

Senior IC Packaging Engineer

positionSan Jose, CA, USA
timeFull-time
remoteOnsite
senioritySenior Level, Lead/Staff
date10+ years exp

Axiado Corporation is an AI-enhanced security processor company redefining the control and management of every digital system. They are seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package in a fast-growing startup environment.

AI InfrastructureArtificial Intelligence (AI)Cloud SecurityCyber SecurityHardwareNetwork SecuritySemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Serve as technical authority for IC and SiP packaging across multiple products and programs
Own package architecture and technology roadmap, aligned with product, cost, and scalability goals
Lead chiplet-based packaging strategies, including UCIe, silicon interposers, and advanced RDL
Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY  (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces
Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes
Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels
Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness
Influence product roadmap, risk management, and investment decisions through technical insight
Establish scalable design methodologies, best practices, and reusable packaging flows

Qualification

IC packaging expertiseChiplet architecturesHigh-speed SerDes developmentCadence Allegro Package DesignerDesign-for-ManufacturingStartup environment experienceTechnical leadershipCross-functional collaboration

Required

BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field
Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products
Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe)
Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization
Demonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment
Technical leadership of multiple end-to-end packaging programs, from early architecture through high-volume production
Proven experience with high-speed SerDes package development, including PCIe Gen5, LPDDR5 / LPDDR5X, USB 3.x or 10G interfaces
Experience defining die-to-die and chiplet based RDL/bump architecture
Direct collaboration with OSATs, foundries, and substrate suppliers for co-development and ramp
Strong cross-functional leadership across design, product, test, operations, reliability, and customer teams
Clear understanding of cost, yield, schedule, and risk trade-offs at a product and portfolio level

Preferred

Cadence Allegro Package Designer (APD) or equivalent EDA tools
Strong background in flip-chip BGA package design and layout
SI/PI expertise preferred, including S-parameter extraction and PDN optimization using HFSS, SIwave, or Ansys Designer
Experience building new packaging methodologies or platforms from scratch

Company

Axiado Corporation

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Axiado is a leading hardware-anchored platform security solutions company deploying a novel, AI-driven approach to platform security against ransomware, supply chain, side-channel, and other cyberattacks in the growing ecosystem of cloud data centers, 5G networks, and other disaggregated compute networks.
dateFounded in 2019
location
San Jose, California, USA
people-size51-200 employees
web-link
https://axiado.com/

H1B Sponsorship

Axiado Corporation has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (13)
2024 (3)
2023 (7)
2022 (11)

Funding

Current Stage
Growth Stage
Total Funding
$205M
Key Investors
Maverick SiliconOrbit Venture Partners
2025-12-02Series C· $100M
2024-12-04Series C· $60M
2021-02-25Series B· $25M

Leadership Team

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Gopi Sirineni
Founder, President & Chief Executive Officer
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Recent News

alleywatch.com
The Weekly Notable Startup Funding Report: 12/8/25
2025-12-09
Crunchbase News
The Week’s 10 Biggest Funding Rounds: Investors Get Back To Writing Large Checks
2025-12-05
PR Newswire
Axiado Corporation Raises $100M in Series C+ Funding to Advance Platform Security and System Management Solutions for AI Data Centers
2025-12-02
Company data provided by crunchbase