Palladyne AI · 19 hours ago
Electronic Board Designer
Palladyne AI, through its subsidiary GuideTech, specializes in high-performance avionics and autonomy software for various aerospace and defense systems. The Electronic Board Designer will collaborate on existing designs and lead new board designs, contributing to schematics, layout guidance, and quality testing processes.
AerospaceArtificial Intelligence (AI)Industrial AutomationRobotics
Responsibilities
Collaborate on BRAIN
Contribute to schematics, constraints, and layout guidance for the BRAIN stack; partner with the current designer on reviews, DFM/DFT, and controlled releases
Support board bring-up & troubleshooting across high-speed and sensor I/O (e.g., MIPI-CSI, USB 3.0, GigE, HDMI, RS-422/485, PWM/DSHOT, IMUs, GNSS/mag/baro, watchdog/reset)
Develop/maintain FPGA RTL (Zynq-7000 SoC): IP integration, constraints, timing closure, and deterministic I/O for controls/sensors
Build functional test fixtures & automation (ATE) and integrate with Hardware-in-the-Loop Simulation to shrink cycle time from assembly to flight testing
Lead New Designs (near-term Pipeline) Such As
ESCs (BLDC): gate-driver selection, current/voltage sense, switching power stage layout, EMC/EMI controls; collaborate on motor-control firmware
Gimbal controllers: motor drivers, IMU integration, precision timing/synchronization, encoder interfaces, jitter/latency budgeting
UAV PDBs: power architecture, protection, high-current layout, thermals, test
AI / CV boards: additional processor modules/chips (camera input, memory, power-up sequencing, drivers)
For each: deliver concept ? schematics ? constraints/stack-up ? DFM/DFT ? CM handoff ? bring-up & verification ? production test
Production & Quality (scale-up)
Contribute to the quality & test plan (incoming inspection criteria, ATP/QTP, boundary-scan/JTAG where applicable, environmental/EMI screening, yield tracking)
Prepare manufacturing build packages, work with contract manufacturers on DFM feedback, and drive ECNs/PCNs
Contribute to failure analysis and corrective actions
Qualification
Required
Have an Electrical Engineering or related degree
Board level design/integration: RS422/SPI/I2C/CAN/USB3/MIPI/PCIe/etc
DDR Memory
MIPI Camera Interfaces
Power Supplies
Board assembly/prototyping: Stencil/non-stencil assembly
0402/QFN/LGA/BGA (0.8mm+ pitch) hand assembly for prototyping
Board Certification: Industry standard testing, Shock/Vibe/EMI/etc
Board rework: Hot plate, Hot air, Soldering certification
Board analysis: Software drivers, VHDL/Verilog IP Blocks, Signal Analysis (Oscilloscope/Logic Analyzer)
Have strong DFM/DFT instincts and collaboration with contract manufacturers (PCB fab + SMT)
Able to lab bring-up & debug (power trees, signal integrity, JTAG/boundary-scan, EMC/ESD hygiene)
Construct clear documentation (schematics, fab/assembly notes, ATP/QTP, ECNs) and team-first communication
Preferred
Power electronics experience (buck/boost, BLDC/FOC, gate-driver layout, thermal design)
Camera systems & Jetson bring-up (device tree, drivers, camera tuning)
Sensor/actuator interfacing for GNC (IMUs, mag, baro, GPS/UWB; PWM/DSHOT/serial buses)
HIL/SIL workflows; test automation (Python/C++); familiarity with FLEX flight software
IPC/avionics standards (IPC-2221, IPC-A-610/J-STD-001, DO-254/DO-160) and AS9100 environments
Benefits
Competitive pay
Potential equity
Bonus
Perks
Benefit
Culture
Company
Palladyne AI
Palladyne AI robotics company that specializes in developing wearable and teleoperated industrial robotics.
Funding
Current Stage
Public CompanyTotal Funding
$323.12MKey Investors
Rotor CapitalSLB
2024-10-31Post Ipo Equity· $7M
2021-09-27Post Ipo Equity· $220M
2021-09-27IPO
Leadership Team
Recent News
2026-01-13
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