SI Interconnect Engineering Intern jobs in United States
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Molex · 14 hours ago

SI Interconnect Engineering Intern

Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting various industries. As an SI Interconnect Intern, you will work at the intersection of mechanical design and electrical performance, supporting the development of next-generation interconnect solutions through advanced simulations and lab validations.

ElectronicsLogisticsManufacturing
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H1B Sponsor Likelynote

Responsibilities

3D EM Simulation & Modeling
Full-Wave Modeling: Assist in creating high-fidelity 3D models of connectors and cable terminations using Ansys HFSS or CST Studio Suite
Virtual Prototyping: Run simulations to extract S-parameters and identify impedance discontinuities within the connector pin-field and mating interface
Optimization: Perform "what-if" analyses on mechanical variables (e.g., pin geometry, plastic dielectric constants, shield spacing) to optimize return loss and crosstalk
Lab Validation & Characterization
High-Frequency Measurement: Use Vector Network Analyzers (VNA) and Time Domain Reflectometers (TDR) to characterize physical prototypes up to 20 GHz or higher
Fixture De-embedding: Learn and apply de-embedding techniques (like AFR or TRL) to remove the effects of test boards, isolating the performance of the connector itself
Correlation: Compare lab measurement data against simulation models to validate accuracy and refine simulation methodologies
Crosstalk Simulation & Discovery (Pre-Silicon/Pre-Layout)
Aggressor-Victim Analysis: Use Ansys HFSS to perform "discovery" simulations identifying the most significant crosstalk contributors within a high-density pin array
NEXT/FEXT Modeling: Extract Near-End Crosstalk (NEXT) and Far-End Crosstalk (FEXT) S-parameters to determine the isolation levels between differential pairs
ICN Calculation: Calculate Integrated Crosstalk Noise (ICN) and Power Sum Crosstalk to evaluate total noise interference against IEEE 802.3 or OIF-CEI limit lines
Pin-Map Optimization: Based on crosstalk discovery, provide recommendations for optimized signal-to-ground ratios and pin-mapping (e.g., G-S-S-G patterns) to shield sensitive high-speed lines
Crosstalk Validation (Lab/Post-Layout)
Multi-Port Measurements: Utilize 4-port or 8-port Vector Network Analyzers (VNAs) to measure real-world crosstalk in physical prototypes and connector mating interfaces
Time Domain Analysis: Use TDR/TDT to locate the exact physical location of a crosstalk "hotspot" within a connector body or cable transition
Correlation: Document discrepancies between simulated crosstalk and measured crosstalk, investigating factors such as manufacturing tolerances in pin-to-pin spacing or plating consistency
Data Analysis & Automation
Scripting: Utilize Python or MATLAB to automate the processing of large Touchstone sNp file datasets
Compliance Testing: Analyze simulation and test results against industry standards such as IEEE 802.3 (Ethernet), USB4, or USCAR-2 specifications
Documentation & Collaboration
Technical Reports: Prepare professional SI reports summarizing performance vs. specifications for internal design reviews
Cross-Functional Support: Interface with Mechanical Engineers to explain how physical design changes impact electrical performance

Qualification

3D EM SimulationHigh-Frequency MeasurementCrosstalk AnalysisAnsys HFSSPython ProgrammingMATLAB ProgrammingTechnical ReportingCross-Functional Collaboration

Required

Currently pursuing a B.S., M.S., or Ph.D. in Electrical Engineering or Physics with coursework focused in Electromagnetics, Microwave Engineering, or Circuit Theory
Strong desire to understand the 'why' behind signal degradation
Ability to translate complex EM concepts into actionable design advice for mechanical teams

Preferred

Understanding of transmission line theory, characteristic impedance and S-parameters
Exposure to Ansys HFSS, ADS, or Cadence Sigrity
Basic proficiency in programming such as Python (NumPy, Pandas, Matplotlib) or MATLAB
Basic experience with oscilloscopes or VNAs is a significant plus

Benefits

Medical
Dental
Vision
Flexible spending and health savings accounts
Life insurance
ADD
Disability
Retirement
Paid vacation/time off
Educational assistance
Infertility assistance
Paid parental leave
Adoption assistance

Company

Molex supplies electronic interconnect solutions and connectivity products for a broad range of industries. It is a sub-organization of Koch, Inc..

H1B Sponsorship

Molex has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (94)
2024 (84)
2023 (73)
2022 (56)
2021 (59)
2020 (63)

Funding

Current Stage
Late Stage
Total Funding
unknown
2013-09-09Acquired

Leadership Team

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Martin Slark
CEO
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Alexandra Haser
Senior Industry Standards Engineer
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Company data provided by crunchbase