Lockheed Martin · 12 hours ago
ElectroMechanical Design Engineer Sr: MicroElectronics
Lockheed Martin is a leader in aerospace and defense, and they are seeking a Senior ElectroMechanical Design Engineer for their Advanced Electronics Packaging team. The role involves designing, prototyping, and testing advanced packaging solutions while collaborating with various engineering teams.
AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
Responsibilities
Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets
Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features
Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes
Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback
Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports
Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems
Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance
Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption
Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts
Qualification
Required
Must be a U.S. citizen
Ability to obtain a secret clearance
Experience with Zuken E3 and Mentor
CCA design and development
IDX File transfer
Flex design
Cable and harness design
Micro Electronics experience
Benefits
Flexible work schedules
Comprehensive benefits investing in your future and security
Company
Lockheed Martin
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.
Funding
Current Stage
Public CompanyTotal Funding
$6.06BKey Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M
Recent News
2026-01-17
Technology - WSJ.com
2026-01-17
2026-01-17
Company data provided by crunchbase