Programmers.io · 3 days ago
Camera Engineer
Sunnyvale, CA
Full-time
Onsite
Senior Level
7+ years expProgrammers.io is currently looking for a Camera Engineer. The role involves developing Camera Module assembly processes and providing technical leadership to resolve process issues while ensuring quality and yield improvement.
Enterprise SoftwareInformation TechnologyManufacturingSoftware
No H1B
U.S. Citizen OnlyHiring Manager
Anas Khan
Responsibilities
Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes
Process technology knowledge in SMT and advanced IC / camera module packaging areas
Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc
Experienced working with subcontract manufacturing partners
High volume manufacturing, and production ramp experience
Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis
Fluent in English communication, additional language skills a plus
Demonstrated ability to perform DOE, data analysis, SPC control
Demonstrated failure mode analysis, root cause investigation, and problem solving for product yield and quality issue
Project Management- Excellent data handling, documentation, critical milestone creation, and organization skill
Strong collaboration skill to work with diversified x-function team
Develop Camera Module assembly process / equipment / materials for FOL (Front of Line) and EOL (End of Line) - Develop new assembly process / equipment / material for Camera module related components - Provide technical leadership in resolving any process issues - Responsible for developing DOEs, Statistical Process Analysis, Process Specification, D/PFMEA and Process control plan - Responsible for Failure analysis, Corrective actions and Yield improvement
Qualification
Required
Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes
Process technology knowledge in SMT and advanced IC / camera module packaging areas
Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc
Experienced working with subcontract manufacturing partners
High volume manufacturing, and production ramp experience
Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis
Fluent in English communication, additional language skills a plus
Demonstrated ability to perform DOE, data analysis, SPC control
Demonstrated failure mode analysis, root cause investigation, and problem solving for product yield and quality issue
Project Management- Excellent data handling, documentation, critical milestone creation, and organization skill
Strong collaboration skill to work with diversified x-function team
Company
Programmers.io
IBM i is evolving. And so are we.
1001-5000 employees
Funding
Current Stage
Late StageLeadership Team
Anshul Choudhry
President
Recent News
linkedin.com
2025-12-12
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2025-12-08
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