HP · 2 days ago
Liquid Cooling Solutions New Product Introduction Expert Engineer
Corvallis, Oregon, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$116K/yr - $182K/yr
10+ years expHP is a leading technology company seeking an Expert level Product Engineer within their liquid cooling solutions business. The role involves overseeing product development processes, ensuring product requirements are met, and leading initiatives to address manufacturing challenges.
ComputerConsumer ElectronicsHardwareIT InfrastructureSoftware
Responsibilities
Understand customer (product) and manufacturing (process) requirements
Assist with Design for Manufacturability (DFM) and Development Effectiveness in new product development to reduce risk at launch of new products
Lead key initiatives to solve issues or reduce risks caused by new technologies or processes
Develop and characterize test methods to minimize or eliminate those risks and ensure the product meets the end-customer requirements
From characterization and test results, refine specifications end-to-end (product to process) to ensure a shippable product
Lead efforts to ensure the high volume manufacturing line is properly aligned with the needs of product design
Lead in the acceptance and transfer activities for new products from proto development to high volume manufacturing
Lead teams that drive root cause evaluation and issue resolution as problems arise in proto and production
Support the efforts of other key organizations such as the Fab, equipment/ tooling design teams, product engineering and printer teams
Deliver clear documentation, reporting and communication of your work
Partner with other organizations to drive product investigations/issue escalations for released products
Manage qualification of change of the released product
Qualification
Required
Education: Bachelor's or Master's degree in Mechanical, Electrical, Chemical or Materials Engineering
10+ years' experience in a product or process development or production environment
Experience in design of experiments and failure modes and effects analysis
Understanding of various root cause evaluation methods (e.g., Kepner Tregoe, fishbone diagram, mind map, etc.)
Knowledge of different issue resolution methods (e.g., 8D, CLCA, etc.) and how to effectively implement
Familiarity in mechanical design and its impact on material and joint design
Managing product quality in the factory including the role and use of SPC
Ability to create test methods and implement audits for product validation
Basic knowledge of 3D Creo with intermediate knowledge of 2D Creo and how to change/modify/update drawings
Ability to broadly contribute in a fast-paced, industrial R&D environment
Excellent communication and teamwork skills
Excellent planning, organizational, and documentation skills
Ability to give clear and effective presentations to inform and persuade peers and managers
Preferred
Desired: experience in complex printed circuit board and/ or GPU board manufacturing
Benefits
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave
Company
HP is a manufacturer and seller of personal computers, printers, computer hardwares, and business solutions.
10001+ employees
H1B Sponsorship
HP has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (193)
2024 (187)
2023 (190)
2022 (200)
2021 (178)
2020 (183)
Funding
Current Stage
Public CompanyTotal Funding
$5.25BKey Investors
U.S. Department of CommerceBerkshire Hathaway
2025-04-14Post Ipo Debt· $1B
2024-08-27Grant· $50M
2022-04-06Post Ipo Equity· $4.2B
Leadership Team
Alex Paranicas
Senior Director, Corporate Strategy
Andrew Bolwell
Chief Disrupter and Global Head of HP Tech Ventures
Recent News
2026-01-22
Company data provided by crunchbase