Advanced Packaging Engineer - SI/PI jobs in United States
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Marvell Technology · 8 hours ago

Advanced Packaging Engineer - SI/PI

Marvell Technology is a leader in semiconductor solutions that form the backbone of data infrastructure. The Advanced Packaging Engineer will be responsible for the design, modeling, and validation of advanced IC packages, ensuring high-speed interfaces and product reliability.

DSPInternet of ThingsManufacturingSemiconductorWireless
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design
Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing, stack‑up, and decoupling guidelines
Analyze power‑distribution networks and high‑speed signal paths from pre‑layout through post‑layout
Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations
Automate analysis workflows using Python (e.g., simulation sweeps, reporting, rule checks)
Document technical results and present recommendations to cross‑functional teams
Contribute to design reviews and support the release of package designs to manufacturing
Use tools such as HFSS, SI‑Wave/Clarity, PowerSI, Spectre/ADS/HSpice, and APD or PADS

Qualification

Electromagnetics2D/3D EM simulationPython scriptingCircuit simulation toolsIC package layout toolsHigh-speed signalingVNA/TDR characterizationPackaging technologiesEMI/EMC practicesCommunication skillsTeam collaboration

Required

MS or PhD in Electrical/Electronics Engineering, Materials Science, or related fields
Strong fundamentals in electromagnetics, transmission lines, and microwave theory
Experience with 2D/3D EM simulation tools (HFSS, SI‑Wave, Clarity)
Familiarity with IC package layout tools such as APD or PADS
Understanding of high‑speed signaling in both frequency and time domain
Exposure to VNA/TDR characterization methods
Working knowledge of circuit‑simulation tools (Spectre, ADS, HSpice)
Python scripting experience for SI/PI or packaging automation
Familiarity with packaging technologies, materials, substrate design rules, and assembly processes
Awareness of EMI/EMC debugging and simulation practices
Strong communication, presentation, and documentation skills
A collaborative team player eager to learn and grow

Preferred

Experience with 2.5D/3D package development, MATLAB‑based channel simulations, or basic thermal/mechanical analysis

Benefits

Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones

Company

Marvell Technology

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We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.

H1B Sponsorship

Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)

Funding

Current Stage
Public Company
Total Funding
unknown
2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired

Leadership Team

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Matthew Murphy
Chairman and CEO
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Radha Nagarajan
SVP & CTO, Optical Engineering
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Company data provided by crunchbase