Intel Corporation · 2 weeks ago
Principal Engineer, Photonics Design
US, California, Folsom
Full-time
Onsite
Lead/Staff
$221K/yr - $312K/yr
12+ years expIntel Corporation is pioneering the future of silicon photonics integration and commercialization. They are seeking a Principal Engineer to lead silicon photonics component design and drive innovation in integrated photonic devices, collaborating cross-functionally to ensure seamless integration across design and performance.
Semiconductors
Responsibilities
Lead and inspire a team of world-class engineers developing next-generation optical components for data centers and emerging applications
Shape Intel’s technology roadmap by influencing product architectures and defining future photonic solutions
Drive cutting-edge design of 112Gbaud+ photonic components, including high-speed modulators, advanced detectors, phase controllers, and next-gen active/passive devices
Collaborate cross-functionally to ensure seamless integration across design, performance, reliability, yield, and certification with Intel and Intel Foundry partners
Deliver breakthrough photonic components that redefine performance and scalability
Set technical direction for Intel’s silicon photonics strategy
Lead innovation at the intersection of photonics, packaging, and system integration
Qualification
Required
MS in Electrical Engineering, Physics, or related field with 12 + years of industry experience
6+ years in silicon photonics IC development from concept to high-volume manufacturing
8+ years designing, simulating, and testing photonic devices in industry or research
Proven track record of taking photonic devices from concept to production
Deep expertise in silicon photonics device physics and design principles
Preferred
Technical leadership experience (leading projects or teams of 3+)
Experience with 100G+ high-speed photonic components
Knowledge of advanced packaging and fiber coupling
Familiarity with foundry processes (AIM Photonics, GlobalFoundries, TSMC)
Publications in peer-reviewed photonics journals
Customer-facing or product development experience
Exposure to advanced materials (BTO, TFLN, III/V), microring modulators, inverse design optimization
System-level link modeling experience
Proficiency with photonic simulation tools (Lumerical, COMSOL, RSoft, or equivalent)
Experience in device characterization and performance validation
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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