Civil Engineer, Global Facilities jobs in United States
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Micron Technology · 3 days ago

Civil Engineer, Global Facilities

Micron Technology is a world leader in innovating memory and storage solutions. As a Civil Engineer within Global Facilities, you will lead and integrate civil scope across various projects, ensuring compliance with operational and contamination control requirements while collaborating with multidisciplinary teams.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Lead civil (design and construction) for advanced semiconductor manufacturing and cleanroom projects across U.S. sites, ensuring alignment with stringent operational and contamination control requirements
Develop site layouts, grading plans and drainage systems optimized for high-tech environments, including vibration-sensitive cleanrooms
Collaborate with multidisciplinary teams (MEP, architectural, process engineering) to integrate CSA (Civil, Structural, Architectural) elements into complex semiconductor facility designs
Prepare and review detailed technical drawings, specifications and related site layout, utility routing, survey, earthwork/grading and stormwater mitigation
Support construction teams during execution by resolving civil design issues and ensuring adherence to semiconductor-specific standards and cleanroom protocols
Manage civil design scope, schedule, and deliverables, coordinating closely with project managers, estimating teams, and construction partners
Ensure compliance with local building codes, seismic requirements, safety regulations, and internal semiconductor facility standards through rigorous design review and change control processes
Participate in bid evaluations, cost estimation, and contractor selection for civil and structural work packages
Support permitting processes for site development, including building, environmental, and water resource permits
Coordinate with government agencies, contractors, and consultants to ensure project compliance

Qualification

Civil EngineeringStructural DesignSite DevelopmentCivil/Structural SoftwareCleanroom DesignProfessional Engineer LicenseProject ManagementSafety CommitmentContinuous ImprovementCommunication Skills

Required

Bachelor's degree in Civil Engineering or related field, or equivalent experience
Minimum 5 years of experience in civil/structural design for semiconductor or advanced manufacturing facilities
Strong knowledge of structural analysis, foundation design, and site development for vibration-sensitive environments
Proficiency in civil/structural design software (e.g., AutoCAD, Civil 3D, STAAD, Revit)
Excellent communication skills with ability to present technical concepts clearly to partners

Preferred

Professional Engineer (PE) license or ability to obtain licensure
Experience with cleanroom design constraints and integration of CSA systems in semiconductor facilities
Familiarity with seismic design requirements and advanced structural systems for high-tech environments
Project Management certification (e.g., PMP) or experience managing civil design packages
Demonstrated commitment to safety, quality, and continuous improvement in semiconductor design and construction environments

Benefits

A choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
A robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase