Intel Corporation · 7 hours ago
Silicon Packaging Design Engineer
US, Arizona, Phoenix
Full-time
Onsite
New Grad, Entry Level
$91K/yr - $173K/yr
0+ years expIntel Corporation is establishing Foundry Services as part of its IDM2.0 strategy, aiming to provide world-class foundry services and capacity to customers globally. The Silicon Packaging Design Engineer will be responsible for end-to-end substrate design, collaborating closely with silicon and hardware teams to optimize performance and cost.
Semiconductors
Responsibilities
Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design
Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon, package, board performance and pinout
Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design
Completes documentation and collateral into the product lifecycle management system of record
Qualification
Required
Bachelor's degree in Mechanical Engineering, Electrical Engineering or related field with 6+ months of relevant experience
-OR- Master's degree in Mechanical Engineering, Electrical Engineering or related field with 1+ years of relevant experience
Familiarity with Cadence APD, Siemens Xpedition, or CAD software, and readiness to troubleshoot a wide variety of physical design/layout issues
Prior experience with physical layout aspects of substrate design/layout including but not limited to custom layouts, floor plans, or schematic layout conversion
Preferred
Performing package I/O routing starting day one
Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions
Microelectronic package substrate technology development
Package design tools such as Package Layout Automation (PLA) and FIELD
Microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS
Extract signal integrity and/or power delivery electrical models and run AC/DC/Frequency Domain simulations
Scripting using Python, VB, C, and/or other language
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
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2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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