Intel Corporation · 23 hours ago
Packaging Module Development Engineer
Phoenix, AZ
Full-time
Hybrid
Entry Level
$134K/yr - $189K/yr
1+ years expIntel Corporation is a leader in semiconductor technology, particularly in packaging solutions for mobile and edge computing. The Packaging Module Development Engineer will be responsible for advancing packaging technology, collaborating with teams to optimize assembly processes, and managing projects related to high-volume manufacturing.
Semiconductors
Responsibilities
Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms
Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability
Drive innovation in next‑generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high‑volume manufacturing
Manage projects to ensure alignment with product development schedules and execution milestones
Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges
Provide sustaining engineering support to maintain equipment performance and process health in high‑volume manufacturing environments
Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
Qualification
Required
PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field
Minimum cumulative GPA of 3.5
At least one publication in a peer-reviewed technical journal
Must have the required degree prior to your start date
Preferred
One or more years of experience in one or more of the following areas: Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Delivery of results for complex, time-critical technical projects
Semiconductor fabrication processes and technologies
Prior related work experience within a semiconductor foundry
Benefits
Competitive pay
Stock bonuses
Benefit programs which include health, retirement, and vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
Recent News
Company data provided by crunchbase