Software Engineering Intern jobs in United States
cer-icon
Apply on Employer Site
company-logo

Texas Instruments · 20 hours ago

Software Engineering Intern

Texas Instruments is a global semiconductor company that designs and manufactures chips for various markets. As a Software Engineering Intern, you will design embedded software and development tools while collaborating with business partners and engineering teams to solve business problems.

ComputerDSPSemiconductor
check
Growth Opportunities
badNo H1Bnote

Responsibilities

Design embedded software and development tools that will be used to test products
Write code that tells chips how to operate in revolutionary new ways
Work closely with business partners and customers
Collaborate and solve business problems

Qualification

C programmingAssembly languageSoftware development lifecycleAnalytical skillsProblem solvingWritten communicationVerbal communicationTeam collaborationTime managementRelationship buildingInitiativeAdaptability

Required

Currently pursuing a undergraduate or graduate degree in Electrical Engineering, Electrical and Computer Engineering, Computer Engineering, Computer Science or related field
Cumulative 3.0/4.0 GPA or higher
C programming skills
Familiarity with assembly language programming
Knowledge of software engineering processes and the full software development lifecycle

Preferred

Demonstrated analytical and problem solving skills
Strong written and verbal communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results

Benefits

Competitive pay and benefits designed to help you and your family live your best life

Company

Texas Instruments

company-logo
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

leader-logo
Richard Templeton
President and Chief Executive Officer
leader-logo
Krunali Patel
Senior vice president and chief information officer
linkedin
Company data provided by crunchbase