Google · 18 hours ago
Chip Package Signal and Power Integrity Lead Engineer
Sunnyvale, CA
Full-time
Onsite
Senior Level, Lead/Staff
$183K/yr - $271K/yr
8+ years expGoogle is a leading technology company focused on AI and Infrastructure, and they are seeking a Chip Package Signal and Power Integrity Lead Engineer. In this role, you will drive package design with signal/power integrity simulation and collaborate with cross-functional teams to optimize hardware solutions for AI/ML applications.
AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
Responsibilities
Drive chip-package-system co-design for HPC by performing SI/PI analysis and optimization using 2.5D/3D technologies to refine product definitions, chip floorplans, and power tree structures
Develop power integrity methodologies and evaluate new package technologies to enhance accuracy, productivity, and performance for advanced hardware projects
Collaborate with chip, system, and supply teams to define SI/PI design targets and explore tradeoffs between performance and DFM for successful production closure
Evaluate high-speed interface IP and provide critical feedback on chip floorplans to ensure optimal package/system routability and signal integrity
Lead the development of innovative methodologies for advanced package technologies, ensuring smooth implementation from early planning through high-volume manufacturing and failure debug
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
8 years of experience with SI/PI design for chip/package or system PCB
Experience in industry SIPI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc.)
Preferred
Master's degree or PhD in Electrical Engineering or Signal/Power Integrity
Experience in 2.5D/3D package design, including silicon interposer, silicon bridge, and 3D die stacking technologies, including expertise in SI/PI analysis for high-speed interconnects (HBMx, D2D, Ethernet, PCIe)
Knowledge of next-generation memory and chiplet standards, including timing budget and design & sign-off methodologies
Understanding of STA, on-chip DVD/EMIR, system voltage budgets, and VR (voltage regulator) modeling and design
Excellent cross-functional leadership skills
Proficient in Python, Matlab, or C++ to establish automation flows and conduct advanced data processing and analysis
Benefits
Bonus
Equity
Benefits
Company
Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
10001+ employees
H1B Sponsorship
Google has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)
Funding
Current Stage
Public CompanyTotal Funding
$26.1MKey Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M
Leadership Team
Sundar Pichai
CEO
Thomas Kurian
CEO - Google Cloud
Recent News
2026-01-22
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Company data provided by crunchbase