Intel Corporation · 19 hours ago
Semiconductor Device Modeling Engineer
Hillsboro, OR
Full-time
Onsite
Senior Level
$150K/yr - $285K/yr
5+ years expIntel Corporation is shaping the future of technology and is seeking a Semiconductor Device Modeling Engineer to support compact modeling activities for new technologies. This role involves collaborating with design teams to enable best-in-class products for data-centric applications and optimizing Intel's state-of-the-art process technology.
Semiconductors
Responsibilities
Support compact modeling activities for Intel's new technologies
Collaborate across multiple teams and geographies
Model self-heating effects and their influence on device and circuit performance
Develop methodologies for device targeting and benchmarking circuits
Model using Open Model Interface (OMI)
Experience developing Layout-dependent effects (LDE) for FinFET or GAAFET technologies
Qualification
Required
Bachelor's degree in Electrical Engineering or a related discipline and 5+ years of industry experience in the semiconductor field; or Master's degree in Electrical Engineering or a related discipline and at least 3 years of industry experience in the semiconductor field; or Ph.D. in Electrical Engineering or a related discipline
Graduate coursework or research experience in semiconductor device physics or 5+ years of work experience in Semiconductor device physics
1+ years' experience Python scripting for data analysis, automation and documentation
Preferred
Ph.D. in Electrical Engineering or a related discipline with 3+ years of industry experience in the semiconductor field
Proficiency with extraction tools (e.g., ICCAP, MBP) and commercial simulators such as HSPICE, Spectre, etc
Hands-on experience with BSIM-CMG and other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA) including experience in one or more of the following areas:
Experience developing Layout-dependent effects (LDE) for FinFET or GAAFET technologies and their impact on circuit performance
Development of methodologies for device targeting (e.g., transistors) and benchmarking circuits (e.g., ring oscillators), including corners and statistical variation models
Modeling using Open Model Interface (OMI)
Strong understanding of process flow, layout, and basic circuit design/simulation
Modeling self-heating effects and their influence on device and circuit performance
Proven capability to collaborate across multiple teams and geographies
Experience with machine learning algorithms and their application is data analysis and compact model development
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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