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Arieca Inc. · 16 hours ago

Engineering Intern (Part-Time) – Spring 2026

Pittsburgh, PA

Internship

Onsite

Intern

$15/hr - $25/hr

Start in 2026 Spring

Arieca Inc. is leading the commercialization of innovative liquid metal embedded elastomer technologies across various industries. The Engineering Intern will be responsible for testing and analyzing thermal and electrical properties of materials, documenting findings, and developing automated scripts to calculate performance metrics.

Advanced MaterialsIndustrialManufacturing

Responsibilities

Testing the thermal and electrical properties of Arieca’s LMEE material architecture in laptops, desktop GPUs, and servers

Analyzing material samples according to company protocols and documenting all findings

Disassembly, re-assembly, and characterization of each device using industry-standard benchmarks

Calculating performance metrics using automated Python scripts that you will develop with your mentor

Qualification

Design of Experiments (DoE)PythonMatlabThermal characterization techniquesData analysisRapid prototypingCommunication

Required

Experience defining Design of Experiments (DoE) test suites, conducting experiments, and documenting results

Methodical, reliable, and excellent at written and verbal communication

Familiarity with Python and/or Matlab

Ability to independently identify both trends and flaws in data, review data with our development team, and discuss possible optimizations

Experience working in an industrial or academic research laboratory

Currently enrolled in an ABET accredited Bachelor of Science or Master of Science program in Mechanical Engineering, Industrial Engineering, Computer Engineering, Electrical Engineering, or equivalent fields of study

Preferred

Experience disassembling electronics for upgrading – laptops, desktop PCs, etc

Knowledge of thermal characterization techniques (TIME, FTDR, etc.) and benchmarking software (Cinebench, HWInfo, etc.)

Rapid prototyping and machine shop experience

Company

Arieca Inc.

Arieca is a leader in advanced thermal interface materials (TIMs) for cooling of high-performance semiconductor chips.

Founded in 2016

Pittsburgh, Pennsylvania, USA

11-50 employees

http://www.arieca.com

Funding

Current Stage

Early Stage

Total Funding

$8.03M

Key Investors

National Science FoundationInnovation WorksITIC: Industrial Technology Investment Corporation

2024-11-18Debt Financing· $0.5M

2022-05-17Series A· $6.5M

2021-03-09Convertible Note

Leadership Team

Navid Kazem

Co-Founder & CEO

Recent News

Google Patent

A thermal interface material, an integrated circuit formed therewith, and a …

2025-05-04

Google Patent

THERMAL CONDUCTIVE MATERIAL, INTEGRATED CIRCUIT ASSEMBLY AND METHOD FOR …

2025-05-04

Monozukuri Ventures Portfolio-Arieca.

2025-04-22

Company data provided by crunchbase