Summer 2026 - Thermal Materials & Management R&D Intern(7338) jobs in United States
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TSMC · 6 hours ago

Summer 2026 - Thermal Materials & Management R&D Intern(7338)

positionSan Jose, CA
timeInternship
remoteHybrid
seniorityIntern
money$37/hr - $44/hr
workcardStart in 2026 Summer

TSMC is a leading dedicated semiconductor foundry, and they are seeking a Summer 2026 intern for their Corporate Research team. The role involves conducting research in thermal materials and innovative cooling solutions, contributing to advancements in semiconductor technology.

Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Lead cutting-edge research and engineering development in advanced thermal materials, characterization techniques, and integrated thermal management solutions for next-generation semiconductor devices
Design, execute, and meticulously analyze complex experiments, leveraging state-of-the-art testing and simulation platforms. Compile comprehensive, insightful reports that drive strategic decisions
Actively engage in high-level research group discussions, presenting your groundbreaking findings and collaborating with our world-class R&D professionals

Qualification

Thermal managementMaterial processingCharacterization techniquesLiquid cooling technologyElectrical measurementsSimulationModelingTechnical problem-solvingAnalytical capabilitiesWritten communicationVerbal communicationCollaborative mindset

Required

Currently pursuing a Master's or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
Demonstrated hands-on expertise in one or more of the following: advanced material processing, sophisticated characterization techniques, innovative device fabrication, precision electrical and thermal measurements, or high-fidelity simulation and modeling
Exceptional technical problem-solving acumen, coupled with superior analytical capabilities and outstanding written and verbal communication skills
A self-driven, proactive mindset with an insatiable curiosity for exploring nascent technologies and a proven ability to thrive within a collaborative, high-performance team environment

Preferred

Proven experience in novel material development, advanced integration processes, and rigorous testing methodologies
Deep familiarity with cutting-edge thermal materials and advanced thermal management concepts
Specific experience with Liquid Cooling Technology (e.g., single-phase, two-phase, microfluidics) or other advanced cooling paradigms
A strong publication record or significant project experience demonstrating your research capabilities in relevant areas

Company

TSMC

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Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
dateFounded in 1987
location
Hsinchu, T'ai-wan, TWN
people-size10001+ employees
web-link
http://www.tsmc.com

H1B Sponsorship

TSMC has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)

Funding

Current Stage
Public Company
Total Funding
$14.2B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B

Leadership Team

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Morris Chang
Founder, Chairman & CEO
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Peter M. Cleveland
Senior Vice President
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Recent News

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TSMC warns Nvidia and Broadcom of capacity squeeze as AI chip demand surges
2026-01-20
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2026-01-20
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2026-01-19
Company data provided by crunchbase