NXP Semiconductors · 1 day ago
R-10060931 System IC Architect - Advanced Power Systems
Chandler, AZ
Full-time
Hybrid
Senior Level, Lead/Staff
15+ years expNXP Semiconductors is seeking a visionary System IC Architect with deep expertise in system-level architecture and high-performance power conversion. This role is pivotal in defining next-generation Point of Load (PoL) solutions, driving innovation in advanced power management with System-in-Package (SiP) integration.
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Hiring Manager
Denise D.
Responsibilities
Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
Support development through thermal optimization and electrical analysis
Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential
Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued
Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
Act as a technical liaison with customers, supporting co-development and design-in activities
Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
Report KPIs and project status to executive stakeholders
Qualification
Required
Deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies
Ability to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions
Expertise in AI compute power
Experience in automotive power management
Ownership of System IC Architecture to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
Development and maintenance of long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
Translation of customer requirements into innovative packaging and power management solutions
Support development through thermal optimization and electrical analysis
Partnership with system solution architects and IC product architects to ensure solutions meet performance, efficiency, space, and cost targets
Leadership in integration of ICs and power semiconductors into advanced packages and systems
Driving early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms
Analysis of customer-specific needs to deliver optimized power efficiency and thermal management strategies
Collaboration with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
Acting as a technical liaison with customers, supporting co-development and design-in activities
Providing strategic insights on state-of-the-art power management technologies and benchmark readiness
Reporting KPIs and project status to executive stakeholders
Preferred
Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
15+ years of experience in power semiconductors, packaging, and system-level integration
Proven track record in product definition through revenue realization
Strong expertise in thermal management, electrical performance, and advanced reliability
Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up
Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
Demonstrated ability to lead cross-functional, global teams and manage complex projects
Excellent communication and interpersonal skills; ability to collaborate across diverse teams
Creative mindset with strong problem-solving capabilities
Willingness to travel globally
Company
NXP Semiconductors
NXP Semiconductors produces secure connectivity solutions for embedded applications.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$2.56BKey Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO
Leadership Team
Bill Betz
Chief Financial Officer
Andy Micallef
EVP Global Operations
Recent News
Hindu Business Line
2026-01-22
2026-01-22
Company data provided by crunchbase