Lightmatter · 8 hours ago
Lead Package Assembly Integration Engineer (Laser Modules)
Lightmatter is leading the revolution in AI data center infrastructure, focusing on advanced semiconductor laser modules. The Lead Package Assembly Integration Engineer will define the packaging roadmap and lead a technical team to address complex challenges in thermal, mechanical, and optical integration.
AI InfrastructureArtificial Intelligence (AI)Data CenterMachine LearningSemiconductorSoftware
Responsibilities
Drive the end-to-end design, analysis, and execution of advanced laser module packaging, overseeing thermal, mechanical, optical, and electrical workstreams
Lead the assembly process definition for flip chip and wirebond approaches and substrate or PCB technology selection
Specify fiber attach methods and optical connector strategies to ensure low-loss, high-reliability coupling
Identify key reliability risks under product use conditions. Plan and execute Design of Experiments (DOE) and perform data analysis to improve product mechanical integrity and assembly yields
Direct external partners and OSATs to ensure seamless technology transfer and high-volume manufacturability
Partner with the Silicon Photonics, Systems, Test and Reliability teams to evaluate architectural trade-offs and deliver optimized hardware solutions
Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required
Write reports and document methodologies
Qualification
Required
MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field
8+ years of experience in semiconductor packaging or micro-electronics assembly
Experience and deep knowledge of traditional and advanced packaging technologies, materials science, and supply chain dynamics
Proficiency in flip chip and wirebond integration, including a strong grasp of design rules for advanced substrates (HDBU, MSAP, HDI)
Proven ability to drive thermal, mechanical, and electrical simulations and analysis
Preferred
Hands-on experience with Silicon Photonics and the integration of semiconductor lasers (III-V)
Specific experience in design and manufacturing of Transceivers, Laser Module Assembly for Datacom or precision optical alignment
Established track record of managing high-tier OSATs and specialized material suppliers
Ability to work independently and tackle projects with minimal supervision
Strong creative thinking skills with the ability to solve problems quickly
Exceptional written and verbal communication skills; ability to summarize complex technical data for executive stakeholders
Benefits
Comprehensive Health Care Plan (Medical, Dental & Vision)
Retirement Savings Matching Program
Life Insurance (Basic, Voluntary & AD&D)
Generous Time Off (Vacation, Sick & Public Holidays)
Paid Family Leave
Short Term & Long Term Disability
Training & Development
Commuter Benefits
Flexible, hybrid workplace model
Equity grants (applicable to full-time employees)
Company
Lightmatter
Lightmatter develops photonic chips that enable data processing and communication using light instead of electricity.
H1B Sponsorship
Lightmatter has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (21)
2024 (12)
2023 (5)
2022 (4)
2021 (4)
2020 (4)
Funding
Current Stage
Late StageTotal Funding
$822MKey Investors
T. Rowe PriceViking Global InvestorsGoogle Ventures
2024-10-16Series D· $400M
2023-12-19Series C· $155M
2023-05-31Series C· $154M
Recent News
2025-11-23
2025-10-09
Company data provided by crunchbase