Intel Corporation · 3 hours ago
Semiconductor Packaging Mechanical Engineer
US, Oregon, Hillsboro
Full-time
Onsite
Entry, Mid Level
$122K/yr - $232K/yr
2+ years expIntel Corporation is a leader in semiconductor manufacturing, and they are seeking a highly motivated Mechanical Engineer to join their Advanced Packaging Mechanical Analysis team. This role focuses on developing multiphysics thermo-mechanical simulations to support the design and qualification of advanced semiconductor packaging, collaborating with various engineering teams across the organization.
Semiconductors
Responsibilities
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages
Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations
Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms
Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs
Leverage both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids
Use a combination of simulations and experiments, as needed, to help solve practical engineering problems
Leverage advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches
Qualification
Required
Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 2+ years of relevant experience
PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
Preferred
Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma
Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics
Experience with designing, planning and executing experiments, along with interpretation of results
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows
Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow
Programming/script development with artificial intelligence and machine learning concepts
Previous related work experience in a semiconductor foundry preferred
Benefits
Competitive pay
Stock bonuses
Benefit programs which include health, retirement, and vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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