IC Package CAD Engineer jobs in United States
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Google · 17 hours ago

IC Package CAD Engineer

positionSunnyvale, CA
timeFull-time
remoteOnsite
senioritySenior Level
money$156K/yr - $229K/yr
date5+ years exp

Google is a leading technology company that develops innovative products and services. As a Chip Package CAD Engineer, you will develop design flow and automation for advanced packaging technologies, collaborating with various engineering teams to create high-performance IC package designs.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Be able to physically package design flow of large form-factor packages for ML High-Performance Computers (HPCs)
Develop and implement the methodology and CAD flow for efficient substrate design, quality improvement, and enhanced productivity
Collaborate closely with SI/PI, thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility
Design library setup and enable modular design
Automate SI/PI modeling flow and close collaboration with physical designers and SI/PI engineers

Qualification

Chip package design/layoutCadence APDMentor ExpeditionPhysical verification flow2.5D/3.5D package designPythonC++MATLABSKILL languageBachelor's degreeMaster's degreePhD

Required

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
Experience in chip package substrate layout, optimization, design verification, DFM and taping out for production
5 years of experience with chip package design/layout using Cadence APD or Mentor Expedition

Preferred

Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture
Experience in physical verification flow (LVS, DRC, connectivity)
Experience with CAD for creating simple mechanical drawings, such as Package Outline Drawings (POD)
Knowledge of and direct experience in large-scale 2.5D/3.5D advanced package design
Programming skills (Python, C++, MATLAB, etc.) to develop automation flow for SI/PI modeling and sign off
Proficiency in SKILL language for APD/Allgegro automation

Benefits

Bonus
Equity
Benefits

Company

Google

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Glassdoor4.4
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Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
dateFounded in 1998
location
Mountain View, California, USA
people-size10001+ employees
web-link
https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)

Funding

Current Stage
Public Company
Total Funding
$26.1M
Key Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M

Leadership Team

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Sundar Pichai
CEO
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Thomas Kurian
CEO - Google Cloud
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