Sensata Technologies · 14 hours ago
Field Applications Engineer – Air & Liquid Cooling Systems -Data Centers
United States
Full-time
Remote
Mid Level
$118K/yr - $162K/yrSensata Technologies is a global leader in sensor and electrical protection technologies, and they are seeking a Field Applications Engineer to focus on thermal management solutions for data centers. This role involves interfacing with customers and equipment providers to deliver high-efficiency cooling technologies while leading technical engagements and ensuring compliance with industry standards.
Electrical DistributionHardwareSoftware
Responsibilities
Utilizes advanced knowledge of engineering principles & practices in the design, development, analysis and release of products throughout the product life cycle
Advises on technical problem resolutions in customer interface meetings. Supports existing customers on new product development projects under development
Communicate business and technical information between the customer and Sensata
Develop and maintain an in-depth technical understanding of Sensata’s products and competitor product offerings
Leads design reviews, both customer and internal, as required; this includes conducting drawing and specification reviews with customers
Advises on failure analysis examinations and prepares failure analysis reports of findings
Ensure projects meet customer requirements and quality standards
Perform engineering analyses. Review product specifications and utilize computer aided engineering applications to apply conditions, replicate performance, and evaluate the manufacturability of products
Help develop and refine 'standard' product configurations that capitalize on the company's strengths and products. Provide onsite technical assistance to the sales team at industry trade shows and customer demonstrations
Negotiate technical specifications
Respond to requests for proposals and assist in the preparation of quotations for standard and custom products
Establish strong relationships with existing customer base at all levels; understand their business strategy and customer applications
Knowledge of basic electrical circuits, microelectronic assembly, statistical methods, process control fundamentals and product test processes
Familiarity with manufacturing methods – welding, brazing, soldering, adhesive bonding, machining, stamping, molding and forming. Basic knowledge of a core manufacturing processes (Calibration, Final Function Transfer, leak testing, welding/soldering, adhesive and gel dispensing)
Establish and maintain customer engineering relations
Lead technical engagements with data center customers, focusing on air-cooled and liquid-cooled architectures, including direct-to-chip and immersion cooling
Ability to articulate value proposition of Sensata products for Cooling Distribution Units (CDUs), Computer Room Air Conditioning / Handling (CRAC/CRAH) units, chillers, cooling towers, and adiabatic systems into customer environments
Translate customer requirements into technical specifications for sensors and controls
Conduct design reviews and failure analysis for cooling system components, ensuring compliance with ASHRAE standards and EPA regulations
Collaborate with engineering and product teams to develop customized products for data center cooling solutions
Provide technical support during trade shows and customer demos, showcasing Sensata’s capabilities in thermal management and intelligent cooling
Assist in proposal development and quotations for standard and custom cooling products tailored to data center environments
Qualification
Required
A university degree required (i.e. Bachelors degree) or equivalent relevant work experience
Must be a team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
Strong communication skills; oral, written and presentation
Strong organization, planning and time management skills to achieve results
Strong personal and professional ethical values and integrity
Holds self-accountable to achieving goals and standards
Proficient in Microsoft Office programs (Outlook, Word, PowerPoint, and Excel)
Strong interpersonal & collaboration skills to work effectively with all levels of the organization including suppliers and/or external customers
Preferred
Experience with HVAC/R systems, including CRAC/CRAH units, chillers, and cooling towers
Familiarity with liquid cooling technologies, including direct-to-chip, immersion (single and two-phase), and hybrid systems
Knowledge of thermal dynamics, fluid mechanics, and heat transfer principles
Exposure to AI and HPC workloads and their impact on cooling requirements
Understanding of ASHRAE TC 9.9 guidelines and data center water classifications
Familiarity with EPA refrigerant regulations, including A2L transitions and low-GWP alternatives
Ability to travel international or domestic
Cooling Distribution Units (CDUs)
CRAC/CRAH Units (Computer Room Air Conditioner/Air Handler)
Chillers (Air, Water, Glycol)
Cooling Towers (Evaporative, Dry, Hybrid)
Direct-to-Chip Cold Plates
Immersion Cooling Tanks (Single-phase and Two-phase)
Rear Door Heat Exchangers (RDHx)
Adiabatic Cooling Systems
Sensors: Pressure, Temperature, Flow, Level, Humidity
Gas Sensing: A2L refrigerants, ammonia
Benefits
Competitive medical, dental, vision, life and disability insurance plans
Education reimbursement
Wellness programs
401(k) retirement plan with Company matching
Paid time off, such as vacation or flex-time, sick, bereavement, and parental leave
Short-term incentive and long-term incentive programs
Company
Sensata Technologies
Sensata Technologies engages in the design, manufacture, and distribution of sensors and electronic controls.
Founded in 2006
10001+ employees
H1B Sponsorship
Sensata Technologies has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (27)
2024 (27)
2023 (18)
2022 (29)
2021 (18)
2020 (17)
Funding
Current Stage
Public CompanyTotal Funding
$500M2024-05-22Post Ipo Debt· $500M
2010-03-11IPO
Leadership Team
George Verras
Chief Technology Officer, Executive Vice President
Daniel L. Black
Member Board Of Directors
Recent News
Providence Business News
2025-12-20
Business Wire
2025-12-11
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