IC Packaging Integration Engineer jobs in United States
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Advanced Microdevices Pvt. Ltd. (India) · 4 hours ago

IC Packaging Integration Engineer

Advanced Micro Devices, Inc is a leading company in next-generation computing experiences. They are seeking an IC Packaging Integration Engineer to drive advanced IC packaging technology development and ensure design for manufacturing, while collaborating with various teams and external partners to enhance product quality and performance.

BiopharmaBiotechnologyIndustrialManufacturing
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Responsibilities

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design
Drive for supplier engagement on continuous improvement and new capabilities ahead of need
Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders
Drive external manufacturer on issue resolution and issue prevention
Monitor and improve product yield and quality through collaboration with design and manufacturing teams
Plan and execute change management from internal or external parties
Involved in regional supplier management – drive to meet Key Performance Indices
Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
Prepare & present Executive Summary of projects and supplier’s performance
Coordination of activities within/external team to deliver critical metrics
Overseas travel is required

Qualification

Flip Chip PackagingSemiconductor manufacturingSignal Integrity (SI)Power Integrity (PI)JMPMinitabFailure analysisPackage reliabilityESD standardsJedec standardsAutomotive standardsProject managementInterpersonal skillsLeadership skills

Required

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field

Preferred

Strong knowledge in Flip Chip Packaging (while operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage)
Track record of development work leading to volume production in Semiconductor manufacturing
Relevant experience in package SI(Signal Integrity) and PI(Power Integrity) is preferred
Good leadership and interpersonal skills
Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
Preferred: PhD in a relevant engineering discipline

Benefits

AMD benefits at a glance.

Company

Advanced Microdevices Pvt. Ltd. (India)

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Advanced Microdevices (mdi) is a leader in innovative membrane technologies.

Funding

Current Stage
Late Stage

Leadership Team

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Nalini Kant Gupta
Founder & Managing Director
Company data provided by crunchbase