Google · 8 hours ago
Advanced Packaging Architect
Sunnyvale, CA
Full-time
Onsite
Senior Level, Lead/Staff
$183K/yr - $271K/yr
8+ years expGoogle is seeking an Advanced Packaging Architect to shape the future of AI/ML hardware acceleration. The role involves driving cutting-edge TPU technology, developing advanced packaging solutions, and collaborating with multi-disciplinary teams to optimize high-performance packages for electrical performance and assembly.
AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
Responsibilities
Own the packaging architecture from early definition to New Product Introduction (NPI), acting as the primary technical lead to define chip construction boundaries during early Tensor Processing Unit (TPU) development
Drive packaging solutions from concept to high-volume production, managing the critical tradeoffs between manufacturing, electrical, thermal, and mechanical requirements
Identify and mitigate packaging risks by establishing engineering plans, conducting test vehicle experiments, and generating comprehensive assembly and reliability test plans
Optimize packaging solutions for yield, cost, cycle time, and quality while ensuring all designs meet the standards of Google's data center infrastructure
Lead project management and communication across internal engineering teams and external suppliers to ensure seamless execution from the design phase through qualification
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
8 years of experience with package development for high volume production
8 years of experience with advance packaging technology development
Preferred
Master's or PhD degree in Electrical Engineering
Experience within wafer foundries or assembly houses, demonstrating an understanding of manufacturing environments
Knowledge in 2.5D and 3D packaging technologies and experience driving innovation through the development of new solutions
Knowledge of general package assembly processes, advanced packaging materials, and reliability standards at both component and board levels
Ability to translate product requirements into packaging specifications by leveraging an in-depth understanding of electrical, thermal, mechanical, and reliability interactions
Proficiency in advanced substrate technologies and high-speed interconnects tailored for High-Performance Computing (HPC) and ML applications
Benefits
Bonus
Equity
Benefits
Company
Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
10001+ employees
H1B Sponsorship
Google has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)
Funding
Current Stage
Public CompanyTotal Funding
$26.1MKey Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M
Leadership Team
Sundar Pichai
CEO
Thomas Kurian
CEO - Google Cloud
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