Google · 10 hours ago
Chip Packaging Technologist
Sunnyvale, CA
Full-time
Onsite
Senior Level, Lead/Staff
$183K/yr - $271K/yr
8+ years expGoogle is seeking a Chip Packaging Technologist to drive cutting-edge TPU technology that powers their AI/ML applications. In this role, you will develop advanced packaging solutions for ML chips and collaborate with multi-disciplinary teams to optimize performance and reliability.
AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
Responsibilities
Define feasible boundaries for chip construction with architecture teams and own the packaging product lifecycle from initial definition through New Product Introduction (NPI)
Drive packaging solutions (2.5D/3D) from concept to production, integrating manufacturing, electrical, thermal, and mechanical requirements
Develop and qualify advanced substrate solutions and build the ecosystem and supply chain necessary to support next-generation package architectures
Drive collaboration with internal teams, Outsourced Assembly and Test (OSATs), and suppliers to deliver production-ready solutions that maintain strict quality and reliability standards
Define Design for Excellence (DFx) methodologies and establish engineering plans using test vehicles to mitigate technical risks and ensure assembly process reliability
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
8 years of experience with package development for high volume production
8 years of experience with advance packaging technology development
Preferred
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture
Experience working within assembly houses (OSATs) or wafer foundries
Knowledge of general package assembly processes, material selection, and reliability requirements at both the component and board levels
Understanding of the interactions between packaging technology, electrical design, thermal/mechanical performance, and manufacturability
Proficiency in 2.5D and 3D packaging technologies and advanced substrates for High-Performance Computing (HPC) applications
Proven track record in developing new technologies, driving innovation, and successfully implementing advanced packaging solutions
Benefits
Bonus
Equity
Benefits
Company
Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
10001+ employees
H1B Sponsorship
Google has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)
Funding
Current Stage
Public CompanyTotal Funding
$26.1MKey Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M
Leadership Team
Sundar Pichai
CEO
Thomas Kurian
CEO - Google Cloud
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