Qualcomm · 4 hours ago
Director, Product Management - Automotive Software (3P OSV Partnerships & Safety OS)
San Diego, CA
Full-time
Onsite
Director/Executive
$196K/yr - $294K/yr
8+ years expQualcomm Technologies, Inc. is seeking a Director of Product Management specializing in Automotive Software. The role involves owning the consolidated roadmap for OS offerings, managing the OSV engagement model, and establishing data-driven KPIs to ensure integration quality and performance.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Own the consolidated roadmap for OS offerings; align with Automotive architecture, platform constraints, and long‑term SDV objectives
Define and manage the OSV engagement model (delivery planning, milestones, governance); drive on‑time artifacts and integration quality
Govern the integration lifecycle across BSP, platform services, and virtualization/hypervisor layers to ensure repeatable, production‑grade patterns
Drive and shape upstream directions for platform components—kernel, build systems, packaging, LTS strategy—to enhance modularity, maintainability, and release cadence
Serve as the primary escalation point for OSV‑related technical or delivery issues; drive crisp decision logs, risk burn‑down, and stakeholder comms
Establish data‑driven KPIs (stability, readiness, performance, certification progress) and publish executive scorecards
Qualification
Required
Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or related field
8+ years of Product Management or related work experience
Preferred
12+ years in Product Management or Technical Product Ownership for OS/platforms or embedded systems, including externally facing delivery
Proven leadership across multi‑stakeholder ecosystems (internal eng, program mgmt, quality, external OS vendors) with roadmap and release accountability
Track record of taking platform features from PRD → plan → production across diverse SoCs and program constraints
Open source ecosystems: Deep, hands‑on familiarity with Linux, Yocto Project, AGL, Zephyr, and related upstream workflows (e.g., layer management, meta‑layers, patches, LTS/long‑tail maintenance, SPDX/OSS compliance basics), including contribution and upstreaming strategies
Platform integration: Experience leading OS bring‑up, BSP integration, partitioning, and virtualization/hypervisor alignment on automotive‑class hardware
Safety & standards: Working knowledge of ISO 26262/functional safety deliverables and how they intersect with OS and BSP integration
Exposure to Automotive SPICE workflows and phase‑gate evidence sufficient to partner effectively with Quality/Program teams
Execution & leadership: Executive‑level communication, partner negotiation, and escalation management; metric‑driven decision‑making and POR discipline
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
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