Mechanical & Hardware Architect jobs in United States
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HP · 23 hours ago

Mechanical & Hardware Architect

HP is a leading technology company, and they are seeking a Mechanical & Hardware Architect to lead multiple project teams. This role involves managing resources, schedules, and costs across projects while providing expertise in mechanical and thermal design.

ComputerConsumer ElectronicsHardwareIT InfrastructureSoftware
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Culture & Values
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H1B Sponsor Likelynote

Responsibilities

Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing
Manages headcount, deliverables, schedules, and costs for multiple ongoing projects, ensuring that resources are appropriately allocated and that goals, objectives, timelines, and budgets are met in accordance with program and organizational roadmaps
Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development
Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality
Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities
Interprets internal/external business challenges and recommends best practices to improve products, processes or services
Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization
Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents
Provides guidance and mentoring to less experienced staff members

Qualification

Mechanical Engineering3D ModelingAnsys Simulation SoftwareProduct DesignMechanical DesignComputer-Aided DesignFinite Element MethodsNew Product DevelopmentPTC Creo (CAD Suite)SolidWorks (CAD)Results OrientationLearning AgilityDigital FluencyCustomer CentricityEffective Communication

Required

Four-year or Graduate Degree in Electrical Engineering, Computer Engineering, Computer Science, or any other related discipline or commensurate work experience or demonstrated competence
Typically has 7-10 years of work experience, preferably in engineering design and solutions, implementation across hardware development lifecycle, or a related field
3D Modeling
Ansys Simulation Software
Computer-Aided Design
Electromechanics
Engineering Design Process
Finite Element Methods
Injection Molding
Machining
Manufacturing Processes
Mechanical Design
Mechanical Engineering
Mechanical Systems
New Product Development
Product Design
Product Lifecycle Management
Prototyping
PTC Creo (CAD Suite)
Sheet Metal
SolidWorks (CAD)
Thermal Management
Effective Communication
Results Orientation
Learning Agility
Digital Fluency
Customer Centricity

Benefits

Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including; 4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave

Company

HP is a manufacturer and seller of personal computers, printers, computer hardwares, and business solutions.

H1B Sponsorship

HP has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (193)
2024 (187)
2023 (190)
2022 (200)
2021 (178)
2020 (183)

Funding

Current Stage
Public Company
Total Funding
$5.25B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2025-04-14Post Ipo Debt· $1B
2024-08-27Grant· $50M
2022-04-06Post Ipo Equity· $4.2B

Leadership Team

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Alex Paranicas
Senior Director, Corporate Strategy
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Andrew Bolwell
Chief Disrupter and Global Head of HP Tech Ventures
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Company data provided by crunchbase