Marvell Technology · 10 hours ago
Advanced Packaging SI/PI Senior Engineer
Marvell Technology is a leader in semiconductor solutions that power data infrastructure across various sectors. They are seeking a Signal and Power Integrity Engineer to support customers with advanced packaging designs, focusing on high-speed signaling and complex power delivery networks.
DSPInternet of ThingsManufacturingSemiconductorWireless
Responsibilities
SI/PI analysis of designs and optimization of 2D/2.5D/3D packages
Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design
Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
Qualification
Required
A knowledge of Electrical Engineering concepts, electro-magnetics, circuit extractions and simulation, as well as design methodology and strategies is required
Bachelor's degree in Electrical Engineering with coursework in signal integrity and power delivery
Understanding of signal integrity and power integrity concepts and fundamentals
Experience with simulation and analysis using tools such as Ansys HFSS, HSPICE, Keysight ADS, Cadence Sigrity
Working knowledge of circuit extractions and simulation techniques
Ability to work with engineers in multiple locations and geographies
Strong communication, presentation and documentation skills
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Benefits
Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Recent News
2026-01-12
2026-01-11
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