R-10061346 Field Application Engineer – Wireless Networks jobs in United States
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NXP Semiconductors · 12 hours ago

R-10061346 Field Application Engineer – Wireless Networks

positionTexas, United States
timeFull-time
remoteHybrid
seniorityMid Level
date3+ years exp

NXP Semiconductors is seeking a highly skilled and motivated Field Application Engineer to support the deployment of industry-leading Wireless technology. The role involves providing pre-sales technical leadership, optimizing embedded systems, and offering design support while collaborating with various stakeholders.

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Hiring Manager
Denise D.
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Responsibilities

Provide pre-sales technical leadership in wireless systems architecture, silicon selection, bring-up, and protocol stack integration
Support and optimize LINUX, Android and embedded in C/C++, including Zephyr, FreeRTOS and more
Perform RF validation, wireless coexistence testing, protocol-compliance verification, and performance tuning
Offer design support through schematic and PCB reviews, bench bring-up, debugging, root-cause analysis, and customer troubleshooting
Deliver on-site and remote proof-of-concept builds using evaluation kits
Lead technical training—webinars, workshops, and internal alignment sessions
Oversee project coordination across stakeholders, manage timelines, and document deliverables

Qualification

Embedded systems developmentC/C++ firmware developmentWireless networking technologiesHardware interfaces knowledgeRF validation experienceTechnical communication skillsProject coordinationTroubleshooting skillsCustomer-facing experienceHands-on lab tools proficiency

Required

Bachelor's or Master's in Electrical Engineering, Computer Engineering, Computer Science, or equivalent
3+ years in embedded systems development or application support with microcontroller or SoC platforms
Proficient in C/C++ firmware development, and IDE tools
Working knowledge of hardware interfaces: UART, SPI, I2C, SDIO, USB, PCIe and Ethernet
Basic understanding of wireless networking technologies: Wi-Fi (IEEE 802.11a/b/g/n/ac/ax), Bluetooth Low Energy (Bluetooth SIG stack), Thread and Matter
Strong troubleshooting skills with schematic review, signal analysis, and lab tools
Excellent verbal and written communication skills for both technical and non-technical stakeholders
Ability to travel up to 50%

Preferred

Experience in wireless RF validation, regulatory certification, and protocol stack integration
Familiarity with ARM Cortex MCUs/SoCs and RTOS platforms (FreeRTOS, Zephyr)
Embedded Software experience (kernel, u-boot, user-space)
Hands-on proficiency with oscilloscopes, spectrum/network analyzers, protocol analyzers
Prior experience as a Field Application Engineer or similar customer-facing role

Company

NXP Semiconductors

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NXP Semiconductors produces secure connectivity solutions for embedded applications.
dateFounded in 1953
location
Eindhoven, Noord-Brabant, NLD
people-size10001+ employees
web-link
https://www.nxp.com

Funding

Current Stage
Public Company
Total Funding
$2.56B
Key Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO

Leadership Team

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Bill Betz
Chief Financial Officer
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Andy Micallef
EVP Global Operations
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Recent News

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Company data provided by crunchbase