Pyramid Consulting, Inc · 8 hours ago
IC Packaging Engineer
Pyramid Consulting, Inc. is a leading company in the Meta Industry, and they are seeking a talented IC Packaging Engineer for a 12+ months contract opportunity. The role requires extensive hands-on experience in semiconductor IC or module packaging, particularly in Camera Module or related processes.
ConsultingInformation TechnologyLegalProfessional ServicesSoftwareStaffing Agency
Responsibilities
Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes
Process technology knowledge in SMT and advanced IC / camera module packaging areas
Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc
Qualification
Required
Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes
Process technology knowledge in SMT and advanced IC / camera module packaging areas
Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc
Preferred
Key Skills; 'Camera', 'SMT', 'IC', 'PACKAGING'
Benefits
Health insurance (medical, dental, vision)
401(k) plan
Paid sick leave (depending on work location)
Company
Pyramid Consulting, Inc
Pyramid Consulting, a global leader in workforce and technology solutions, empowers individuals and organizations to transform and thrive in the most challenging and competitive markets.
H1B Sponsorship
Pyramid Consulting, Inc has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (178)
2024 (112)
2023 (95)
2022 (62)
2021 (50)
2020 (117)
Funding
Current Stage
Late StageRecent News
2025-08-18
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