NXP Semiconductors · 10 hours ago
Field Application Engineer – Wired Networking
NXP Semiconductors is seeking a highly motivated Field Application Engineer to join their FAE team, focusing on the deployment of advanced networking and high-speed communication technologies in automotive and industrial embedded systems. The role involves providing technical leadership, troubleshooting complex issues, and delivering proof-of-concept builds while supporting a collaborative work environment.
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Responsibilities
Provide technical leadership to sales team covering networking architecture, silicon and product selection, bring-up, and software stack integration for NXP Ethernet switch/PHY, CAN, LIN, and SerDes products
Offer design support through schematic and PCB reviews, bench bring-up, debugging, root-cause analysis, and customer troubleshooting
Troubleshoot complex issues in the lab (schematics, board bring-up, software drivers) using tools like oscilloscopes, network analyzers and software debug/trace tools
Perform validation and performance tuning for Ethernet, CAN, LIN, and SerDes interfaces
Deliver on-site and remote proof-of-concept builds using evaluation kits
Lead technical training—webinars, workshops, and internal alignment sessions
Oversee project coordination across stakeholders, manage timelines, and document deliverables
Qualification
Required
Bachelor's or Master's in Electrical Engineering, Computer Engineering, Computer Science, or equivalent
5+ years in embedded systems development or application support with microcontroller or SoC platforms
Proficient in C/C++ firmware development and debugging with ARM microcontrollers
Working knowledge of Ethernet controllers, e.g. MAC, PHY, DMA, filters/queues, MDIO, etc
Basic understanding of hardware interfaces for CAN, LIN, PCIe, and SerDes
Strong troubleshooting skills with schematic review, signal analysis, and lab tools
Excellent verbal and written communication for both technical and non-technical stakeholders
Ability to travel up to 50%
Preferred
Expert in automotive and industrial networking technologies: Ethernet, CAN / CAN-FD, LIN, PCIe, and high-speed SerDes (e.g., MIPI, PCIe, SGMII, automotive SerDes Alliance standards)
Experience in silicon bring-up, interface validation, regulatory certification, and protocol stack integration for Ethernet, CAN, LIN, and SerDes
Experience with low-latency, deterministic ethernet communication using TSN features including time synchronization (PTP) and traffic shaping protocols
Experience with ethernet network segmentation (VLANs) and security (MACsec)
Familiarity with ARM Cortex MCUs/SoCs and RTOS platforms (FreeRTOS, Zephyr)
Experience configuring and integrating AUTOSAR MCAL drivers for automotive MCUs
Embedded Linux experience (kernel, u-boot, user-space)
Experience optimizing PCB schematic design and layout for high-speed communication signals, including EMC/EMI for signal integrity
Hands-on proficiency with oscilloscopes, spectrum/network analyzers, protocol analyzers
Prior experience as a Field Application Engineer or similar customer-facing role
Benefits
Health
Dental, and vision insurance
401(k)
Paid leave
Company
NXP Semiconductors
NXP Semiconductors produces secure connectivity solutions for embedded applications.
Funding
Current Stage
Public CompanyTotal Funding
$2.56BKey Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO
Recent News
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