Empower Semiconductor · 1 day ago
Principal Packaging Engineer
Milpitas, CA
Full-time
Onsite
Lead/Staff
15+ years expEmpower Semiconductor is a power management technology leader redefining power delivery for demanding AI processors. They are seeking a talented and experienced Packaging Engineer to lead the development of next-generation power packaging solutions, collaborating cross-functionally to deliver innovative solutions in a fast-paced environment.
AI InfrastructureArtificial Intelligence (AI)ManufacturingMobile DevicesSemiconductor
Responsibilities
Defining substrate/package design rules, process flows and material sets for new power module packages
Driving alignment between module substrate design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
Developing new assembly technologies, run process DOE’s, define process windows for new package development
Driving reliability testing and qualification of new packages in conjunction with the reliability function
Working closely with offshore assembly and substrate partners to develop new processes
Working closely with IC design teams to define package design rules and define packages to meet their requirements
Collaborating with multi-functional teams within Empower Semiconductor for successful development, qualification and production ramp of new module products
Qualification
Required
BS Degree in Electrical Engineering, Mechanical Engineering, Material Science
Minimum experience 15+ years in semiconductor packaging technology
Experience leading multi-die packages
Understanding of organic laminate technologies manufacturing and supplier capabilities
Experience with package substrate design rules, tools (including AutoCAD)
Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout
Extensive experience collaborating with OSAT vendors/suppliers
Experience in SMT or passive integrated package assembly
Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
Knowledge of AEQ reliability requirements
Occasional travel to attend technology reviews and resolve subcon/supplier issues may be required
Preferred
APQP automotive development process is a plus
Knowledge of JEDEC/IPC design standards is a plus
Company
Empower Semiconductor
Empower Semiconductor is a technology company enabling the design of high efficiency, integrated voltage regulators in SoCs.
51-200 employees
H1B Sponsorship
Empower Semiconductor has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3)
2023 (5)
2022 (1)
2020 (3)
Funding
Current Stage
Late StageTotal Funding
$215MKey Investors
FidelityMESH
2025-09-22Series D· $140M
2023-03-07Series Unknown· $30M
2021-10-26Series C· $45M
Leadership Team
Tim Phillips
CEO & President, Founder
Gene Sheridan
Board Member
Recent News
2025-10-05
2025-10-05
Company data provided by crunchbase