Packaging and Assembly lead jobs in United States
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Lyte · 8 hours ago

Packaging and Assembly lead

Lyte is a company that builds perception systems for Physical AI operating in complex environments. The role involves leading the NPI process team for optical sensor device packaging and contract manufacturing, focusing on process improvement and optimization for yield enhancement.

Artificial Intelligence (AI)ComplianceFinTechQuantum ComputingReal TimeRobotics

Responsibilities

Lead NPI process team involving wafer, device packaging, PCBA assembly process improvement and optimization for yield improvement through material selection optimization, process refinement, or specs opening through DOE for corner case studies
Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step
Lead the tradeoff between the design and process
Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture
Lead process integration check to ensure the upstream process will not affect the downstream process yield
Act as the technical program manager for operation process team
Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase
Develop and maintain packaging and component specifications as well as inventory tracking
Audit/regularly visit our contract Manufacturers and suppliers then provide reports
Write technical reports and present results to internal and external stakeholders
Build and grow the Operation Process Team worldwide
Write technical SOW
Drive Cp, Cpk, and yield improvement

Qualification

Process integrationMicroelectronic packagingProject managementFMEAData analysis softwareSilicon PhotonicsWork ethicsFast learnerCross-functional collaborationConfidentiality

Required

Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience
Experience with process integration for process flow design and continue process improvement
Former experience of microelectronic and optical devices packaging is a must
Project management capability/experience is a must
Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important
Experience with FMEA, failure analysis, and 8D report
Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must
Fast learner is a must
Good work ethics is a must
Capable of keeping company confidential information and IP is a must

Preferred

Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable
Familiar with data analysis software such as JMPs is a plus
Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus
Experience with PCBA process is highly desirable
Understanding Silicon Photonics is a plus
Experience in IIIV wafer process, bar level process, and CoC packaging is a plus
Supplier quality management experience is a plus
Knowledge of Lidar and relevant technologies is a plus
Former experience of writing technical SoW is a plus
Familiar with ECN, PCN and documentation are highly desirable

Benefits

Competitive salary and equity
Comprehensive medical, dental, and vision coverage
401(k) retirement plan
Flexible vacation and time-off policy
Collaborative, fast-paced, and inclusive work environment
Opportunity to work on cutting-edge technologies with a highly cross-functional team

Company

Lyte

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Lyte is the perception layer of Physical AI.

Funding

Current Stage
Growth Stage
Total Funding
$107M
Key Investors
Avigdor Willenz
2026-01-05Series Unknown· $107M
Company data provided by crunchbase