PlanIT Group, LLC · 13 hours ago
Light Industrial - Assembler
PlanIT Group, LLC is seeking a highly experienced Solder Assembler with expertise in surface mount technology and through hole soldering. The role involves performing soldering on printed circuit boards, conducting inspections, and ensuring quality in the production of aerospace and defense electronics.
ConsultingInformation TechnologyManagement Consulting
Responsibilities
Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards
Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations
Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings
Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications
Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print” practices where required
Qualification
Required
highly experienced Solder Assembler with deep expertise in both surface mount technology (SMT) and through hole soldering
proficient in reworking and repairing a wide range of components—including bottom terminated devices such as QFNs, BGAs, and LGAs—using advanced rework equipment and X ray inspection methods
perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards
remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations
conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings
execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications
interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply 'build to print' practices where required
minimum 5 years of handson SMT/TH solder assembly in a highmix, lowvolume environment (aerospace, defense, or similar)
additional certification (e.g., IPCA610, IPCJSTD001)
ability to sit for extended periods and lift to 25 lb (11 kg)
vision acuity (or corrective lenses) sufficient for detailed microscope work
Company
PlanIT Group, LLC
PlanIT Group is an IT and engineering professional services company which provides top-tier talent to various commercial and government customers.
Funding
Current Stage
Growth StageTotal Funding
$3.55M2020-09-24Series Unknown· $3.55M
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