Molex · 2 hours ago
Principal Packaging Engineer, R&D
Fremont, CA
Full-time
Onsite
Lead/Staff
$180K/yr - $280K/yr
10+ years expMolex is a leader in the optical industry, providing high-performance optical solutions. The Principal Packaging Engineer will lead the technical design and optimization of advanced optoelectronic packages, collaborating closely with R&D, manufacturing, and suppliers to ensure reliability and performance of laser components.
ElectronicsLogisticsManufacturing
Responsibilities
Provide technical leadership and creativity to design novel III-V laser diode packaging technologies to support Datacenter growth
Design packages that includes components (e.g., TEC, housing, lid, getter, fiber lens or discrete lenses, gratings)
Develop processes that includes submicron alignment (x, y, z, f), solder attach of components (e.g., laser diode, ceramic mounts, TEC, etc.) and hermetic lid sealing
Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
Support sub-component supplier selection and evaluation, including technology maturity assessments for robust supply chain
Support supplier improvement through audits, quality improvement plans, and risk-mitigation initiatives
Define and oversee component pre-qualification and qualification strategies, including GR-468 Telcordia compliance
Support failure analysis investigations and corrective actions for product related failures and manufacturing issues, working with internal teams, suppliers, and customers
Work intimately with laser diode experts to create optimized designs
Qualification
Required
PhD in Photonics, Mechanical Engineering, Physics, Optics, or a closely related field
At least 10 years of industry R&D experience with mechanical design of optoelectronic packages developed and transferred to manufacturing environments
Hands-on experience with optical alignment of components to submicron tolerances, designing for high thermal power density
Mechanical design layout using Mech software package/s with finite element analysis (FEA) understanding (e.g., to calculate stress/design from CTE mismatch, optic misalignment, thermal limits etc.)
Knowledgeable of various optical components (e.g., gratings, mirrors, lenses), stable attachment methods (e.g., epoxy and solder based)
Expertise in component qualification methodologies (e.g., GR-468), product reliability testing, and statistical analysis tools
Knowledgeable of component and optical-packaging failure modes, with a demonstrated track record in failure mode analysis and resolution
Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
Strong communication skills with suppliers, customers, and cross-functional internal teams
Preferred
CFD is a plus, but not required
Benefits
Medical
Dental
Vision
Flexible spending and health savings accounts
Life insurance
ADD
Disability
Retirement
Paid vacation/time off
Educational assistance
Infertility assistance
Paid parental leave
Adoption assistance
Company
Molex
Molex supplies electronic interconnect solutions and connectivity products for a broad range of industries. It is a sub-organization of Koch, Inc..
10001+ employees
H1B Sponsorship
Molex has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (94)
2024 (84)
2023 (73)
2022 (56)
2021 (59)
2020 (63)
Funding
Current Stage
Late StageTotal Funding
unknown2013-09-09Acquired
Leadership Team
Martin Slark
CEO
Alexandra Haser
Senior Industry Standards Engineer
Recent News
2026-01-22
Company data provided by crunchbase