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Google · 7 hours ago

Signal and Power Integrity Engineer

Sunnyvale, CA, USA

Full-time

Onsite

Mid Level

$156K/yr - $229K/yr

4+ years exp

Google is seeking a Signal and Power Integrity Engineer to join their team, focusing on developing custom silicon solutions for their consumer products. The role involves driving chip package design with signal and power integrity simulation, collaborating with multi cross-functional teams to meet electrical requirements.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO

Growth Opportunities

H1B Sponsor Likely

Responsibilities

Drive SI/PI analysis and optimization for HPC based on 2.5D/3D technology, influencing product definition, chip floorplan, power tree structures, and netlists

Lead the development of next-generation memory interfaces and evaluate high-speed Interface IP, considering IO PHY, physical design, and SI/PI requirements

Manage Post-Silicon validation and qualification of high-speed interfaces for New Product Introduction (NPI), ensuring performance meets production standards

Partner with chip/system design teams and external vendors to define SI/PI design targets, set chip boundaries, and balance SI/PI and DFM tradeoffs for production closure

Develop innovative methodologies to enhance simulation accuracy and productivity while providing critical feedback on chip floorplans to optimize routability and signal integrity

Qualification

SI/PI design experienceSIPI modeling toolsHigh speed interconnects2.5D/3D package designMATLAB programmingPython programmingC++ programmingData analysis skillsCross-functional collaboration

Required

Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience

4 years of experience in SI/PI design for chip/package or system PCB

Experience in industry SIPI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc.)

Preferred

Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field

Signal and power integrity experience with various high speed interconnects (e.g., HBMx, D2D, Ethernet, PCIe, etc.)

Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking

Cross-functional experience and co-design with chip top design, physical design, STA, package, system and validation teams

Familiar with post SI test environment on memory or high speed serdes

Proficient programming skill and data analysis skill with MATLAB, python, C++, etc. to establish automation flows and data processing

Benefits

Bonus

Equity

Benefits

Company

Google

Glassdoor4.4

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

Founded in 1998

Mountain View, California, USA

10001+ employees

https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (8763)

2024 (8872)

2023 (9682)

2022 (11626)

2021 (9109)

2020 (9785)

Funding

Current Stage

Public Company

Total Funding

$26.1M

Key Investors

Andy Bechtolsheim

2004-08-19IPO

1999-06-07Series Unknown· $25M

1998-11-01Angel· $1M

Leadership Team

Sundar Pichai

CEO

Thomas Kurian

CEO - Google Cloud

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