Teledyne Technologies Incorporated · 21 hours ago
Electronics/ Electro-Mech Assembler
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. The role involves performing electronic and electro-mechanical assembly operations under close supervision, focusing on precision RF solutions for defense and telecom markets.
ElectronicsEnergyManufacturingTelecommunications
Responsibilities
Perform electronic and electro-mechanical assembly operations under close supervision
Solder and de-solder through-hole and SMT components using soldering iron and hot air techniques
Assemble connectors, housings, and perform interface gage measurements
Place and shrink marker sleeves and strain reliefs; check mechanical cable lengths
Read and interpret documents and drawings accurately
Qualification
Required
High school diploma or equivalent (required)
Ability to lift, move, and carry parts and boxes; mobility to move throughout the plant (required)
Strong hand-eye coordination and dexterity (required)
Ability to read and interpret documents and drawings (required)
Must be a U.S. Person (includes U.S. citizens, lawful permanent residents, refugees, and asylees) (required)
Preferred
Soldering experience or MIL Standard Soldering Certification (advantage)
1–2 years related assembly experience (advantage)
Benefits
Competitive pay and comprehensive health benefits
401(k) with company match and retirement plans
Paid time off and flexible work arrangements
Professional development and training opportunities
Employee wellness programs and assistance resources
A collaborative environment working on mission-critical technology
Company
Teledyne Technologies Incorporated
Teledyne Technologies is a leading provider of sophisticated electronic components, instruments & communications products, including defense electronics, data acquisition & communications equipment for airlines and business aircraft, monitoring and control instruments for industrial and environmental applications and components, and subsystems for wireless and satellite communications.
Funding
Current Stage
Public CompanyTotal Funding
unknown1999-12-03IPO
Leadership Team
Recent News
2026-01-23
2026-01-22
2026-01-22
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