Qualcomm · 1 day ago
Principal Engineer, AI Compute and Chiplet Systems Technologist
Austin, Texas, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$192K/yr - $288K/yr
6+ years expQualcomm Technologies, Inc. is seeking a highly skilled and experienced engineer to develop system-technology co-optimized solutions for the slowing Moore’s law era. The role focuses on identifying and driving individual process technology components to achieve optimal E2E system KPIs for AI and emerging workloads, collaborating with various teams to develop and execute implementation strategies.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Develop system-technology co-optimized solutions for AI and emerging workloads
Identify and drive individual process technology components to achieve the best E2E system KPIs
Collaborate with high-level representatives across functional teams and external vendors to develop and execute an implementation strategy that meets system requirements
Qualification
Required
Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience
OR Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience
OR PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience
Thorough understanding of E2E system KPI dependency e.g. power, performance and TCO on the underlying process technology components and the ability to identify and drive the key individual process components and architectures
Good knowledge of underlying components e.g. tech node, logic IPs, SRAM, DRAM, NVM memory architecture, electrical and optical networking and 2.5D, 3D, 3.5D integration schemes and their interactions and trade-offs for E2E KPI optimization
Ability to model and script (with internal/ external tools) the system use case impact of 3D, 3.5D integration of process tech node logic, 3D SRAM and DRAM architectures and networking (electrical and optical)
Ability to map emerging system use cases to hardware, chiplet and process architecture solutions; and vice versa
Exceptional creativity to innovate new ideas and develop innovative products/ processes without established objectives or known parameters
Verbal and written communication skills to convey highly complex and/or detailed information. Will require strong negotiation and influence with large groups or high-level constituents
Ability to work independently and as part of a team
Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach
Deductive and inductive problem solving is required; multiple approaches may be taken/necessary to solve the problem; often information is missing or conflicting; advanced data analysis and interpretation skills are required
Preferred
Master's or Ph.D. in Electrical Engineering, Computer Science, or a related field
12+ years of ASIC design, verification, validation, integration, or related work experience
4+ years of experience with architecture and design tools
4+ years of experience with scripting tools and programming languages
4+ years of experience with design verification methods
2+ years of work experience in a role requiring interaction with senior leadership (e.g., Vice President level and above)
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
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