Samsung Electronics · 18 hours ago
Senior Technologist, Advanced Package
San Jose, CA
Full-time
Onsite
Senior Level, Lead/Staff
$163K/yr - $253K/yr
8+ years expSamsung Electronics is a global leader in technology solutions, powering a wide range of devices and infrastructure. They are seeking a Senior Advanced Package Technologist to lead technical strategy and customer engagement in the field of advanced packaging for datacenter SoCs, focusing on next-generation AI and HPC infrastructure.
Consumer ElectronicsElectronicsManufacturingMobile AppsMobile Devices
Responsibilities
Lead Customer Technical Engagement: Serve as the technical authority in meetings with Tier-1 datacenter customers; address requirements for interconnect bandwidth, power efficiency, and thermal management
Translate Requirements to Execution: Deconstruct high-level customer product visions into actionable engineering specifications. Define technical requirements for HBM integration, fine-pitch micro-bumps, and advanced substrate technologies for internal development teams
Drive Technology Roadmaps: Evaluate and influence the long-term Advanced Packaging roadmap. Assess the feasibility of emerging technologies—including Hybrid Bonding, Co-Packaged Optics (CPO), and Optical I/O—specifically for the Datacenter SoC market
Strategic Project Leadership: Lead the technical lifecycle of packaging projects by identifying bottlenecks, proposing performance-cost trade-offs, and ensuring cross-functional alignment
Collaborative Architecture Review: Partner with SoC Architects, Signal/Power Integrity (SI/PI) teams, and Foundry/OSAT partners to ensure package designs support high-speed data transmission and high-power delivery
Complete other responsibilities as assigned
Qualification
Required
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field with 10+ years of experience; or a Master's Degree with 8+ years; or a PhD with 5+ years of industry experience
7+ years of experience in semiconductor packaging, specifically within the Datacenter or HPC ecosystem
Deep architectural understanding of 2.5D/3D integration, Chiplets, HBM, and TSV technologies, including the challenges inherent in large-die, multi-chip modules
Proven experience in a technical marketing, applications engineering, or architectural role where you have influenced product roadmaps and managed high-stakes technical relationships
Ability to balance cutting-edge technical possibilities with business realities such as time-to-market, yield optimization, and supply chain constraints
Exceptional verbal and written communication skills, with the ability to distill complex technical concepts for both executive and engineering audiences
You're inclusive, adapting your style to the situation and diverse global norms of our people
An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding
You're collaborative, building relationships, humbly offering support and openly welcoming approaches
Innovative and creative, you proactively explore new ideas and adapt quickly to change
Benefits
Medical/Dental/Vision/401k
Charitable giving match
4+ weeks of paid time off a year
Holidays and sick leave
Stipend for fertility care or adoption
Medical travel support
Virtual vet care for your fur babies
On-demand apps and free confidential therapy sessions
Onsite Café and gym
Virtual classes
Flexible environment
Company
Samsung Electronics
Samsung Electronics is a technology company that engages in consumer electronics, IT and mobile communications, and device solutions.
10001+ employees
H1B Sponsorship
Samsung Electronics has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (206)
2024 (143)
2023 (234)
2022 (169)
2021 (144)
2020 (144)
Funding
Current Stage
Public CompanyTotal Funding
$4.75BKey Investors
U.S. Department of Commerce
2024-04-15Grant· $4.75B
2023-01-10Post Ipo Equity
1975-06-11IPO
Leadership Team
Boo-Keun Yoon
President & CEO
Jong Hee Han
Vice Chairman & CEO
Recent News
2026-01-25
2026-01-25
Company data provided by crunchbase