Intel Corporation · 13 hours ago
Substrate Material and Process Development Engineer
Phoenix, AZ
Full-time
Hybrid
Mid, Senior Level
$134K/yr - $255K/yr
4+ years expIntel Corporation is a leading company in semiconductor innovation, and they are seeking a Substrate Material and Process Development Engineer to develop revolutionary substrate materials and processes. The role involves optimizing manufacturing efficiency and driving continuous improvement in packaging technologies.
Semiconductors
Responsibilities
Define substrate materials roadmap to enable leading edge packaging technologies
Develop material and process specifications applying principles of design of experiments and data analysis and document improvements through white papers
Work with material vendor for new material development to meet Intel process capability and performance target
Innovate new process concepts and validate process flow for HVM applications
Qualify new materials and processes with comprehensive characterization plans
Optimize and improve the efficiency of manufacturing of packages, developing material/processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements
Drive continuous improvement projects and problem-solving efforts
Collaborate with cross-functional teams throughout all project phases
Provide excellent communication
Skills to navigate uncertainties
Ability to work in a matrixed environment with smooth stakeholder interactions
Responsible and commitment with a can-do attitude
Travel and flexibility to meet business needs
Qualification
Required
Bachelor's with 6 years of experience or Master's degree in 4 years of experience or PhD with 2+ years of relevant experience in Polymer Science and Engineering, polymer physics, Materials Science, Chemical Engineering, or related science and engineering fields
2+ years of experience in polymer synthesis or advanced packaging and assembly processes
Preferred
4+ years of experience in polymer synthesis, materials development, and materials science fundamentals
4+ years of advanced packaging and assembly process experience
Materials characterization skills (SEM, FTIR, TMA, DMA, DSC, TGA, SIMS, mechanical testing)
Experience in tool and process PCS, data analysis, statistical tools and methods
Benefits
Competitive pay
Stock bonuses
Benefit programs which include health, retirement, and vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
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2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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