Manager, Technical Program Management jobs in United States
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Applied Materials · 1 day ago

Manager, Technical Program Management

Applied Materials is a global leader in materials engineering solutions for semiconductor chips and advanced displays. They are seeking a Technical Program Management Lead to head the TPM function, manage a team of TPMs, and drive program execution across R&D and device commercialization in a fast-paced environment.

ElectronicsManufacturingSemiconductorSoftware
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H1B Sponsor Likelynote

Responsibilities

Lead and grow a team of Technical Program Managers; provide coaching, career development, and performance management
Define the TPM operating model for PPB, including governance, cadences, decision‑making processes, and execution standards
Drive complex, multi‑disciplinary programs from concept through EVT/DVT/PVT and customer release
Translate broad, ambiguous objectives into clear, actionable program strategies, execution plans, and measurable milestones
Ensure program objectives are well‑defined and aligned across Engineering, Ops, Manufacturing, Finance, Product, and Executive stakeholders
Apply conceptual and innovative thinking to solve unique, first‑of‑its‑kind technical and organizational challenges
Anticipate internal and external risks; establish mechanisms for early detection and mitigation
Partner with PMO lead to architect and deploy scalable program management processes, including roadmap governance, readiness reviews, risk tracking, and cross‑functional OKRs
Drive operational discipline by embedding PMO‑developed processes into daily execution and ensuring teams follow clear, scalable rhythms for planning, risk management, and cross‑functional alignment
Surface execution gaps, friction points, and scaling challenges, and provide strategic input to the PMO to refine processes as the organization grows rapidly
Champion a culture of predictable execution and continuous improvement, ensuring processes remain lightweight, effective, and suitable for a fast‑paced AR hardware team
Serve as the connective tissue between Engineering, Systems Engineering, Manufacturing, Operations, Quality, Product Management, and Executive Leadership
Manage cross‑functional interdependencies, drive accountability, and ensure timely resolution of critical issues
Lead executive‑level program reviews, enabling data‑driven decision‑making and clear trade‑off analysis
Influence senior stakeholders and build organization‑wide alignment in a high‑ambiguity, high‑pressure environment
Coordinate with internal and external customers to define objectives, align on success criteria, and prepare for product deployment
Provide clear, concise updates on device readiness, program risks, and path to launch
Ensure smooth transitions between development phases and customer industrialization phases

Qualification

Technical Program ManagementEnd-to-end product lifecycleRisk managementSystems-level thinkingCross-functional leadershipHigh tolerance for uncertaintyCommunication skillsLeadership experience

Required

10–15+ years of Technical Program Management experience, including leadership roles in fast‑paced hardware organizations
End‑to‑end product lifecycle experience, including EVT/DVT/PVT
Demonstrated success scaling program management processes in high‑growth teams or startup environments
Master's degree in Engineering or related technical field; advanced degree preferred
Demonstrated ability to lead programs with significant technical, organizational, and schedule risk
Strong communication skills with the ability to articulate complex technical ideas, anticipate objections, and influence senior leaders
Proven track record of operating successfully in ambiguous, fast‑growing, greenfield environments
High tolerance for uncertainty and ability to impose structure and clarity in the absence of established processes
Exceptional systems‑level thinking, risk management, and cross‑functional leadership

Benefits

Comprehensive benefits package
Participation in a bonus and a stock award program

Company

Applied Materials

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Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.

H1B Sponsorship

Applied Materials has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)

Funding

Current Stage
Public Company
Total Funding
$2.1B
Key Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M

Leadership Team

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Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
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Tony Chiang, Ph.D
VP, CTO Applied AI
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Company data provided by crunchbase