HP · 7 hours ago
New Product Introduction Process/Tooling Engineer
Corvallis, Oregon, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$116K/yr - $182K/yr
10+ years expHP is a world-class technology pioneer seeking a New Product Introduction Process/Tooling Engineer for their liquid cooling solutions business. This role involves supporting R&D prototyping and production processes, focusing on developing manufacturable processes for new products.
ComputerConsumer ElectronicsHardwareIT InfrastructureSoftware
Responsibilities
Understand customer (product) and manufacturing (process) requirements
Design engineering solutions for mechanical, electrical and electronic parts, subsystems, integrated circuitry, and algorithms based on engineering fundamentals
Develop and implement new tooling designs, process parameters and test plans for new and existing products, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, thermal generation, and system power measurements
Lead key initiatives to solve issues or reduce risks caused by new technologies or processes
Collaborate and communicate with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution
Lead project teams of other engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for our products
Lead teams that drive root cause evaluation and issue resolution as problems arise in proto and production
Assist with Design for Manufacturability (DFM) and Development Effectiveness in new product development to reduce risk at launch of new products
Provide guidance and mentoring to less- experienced staff members
Qualification
Required
Education: Bachelor's or Master's degree in Mechanical, Electrical, Chemical or Materials Engineering
10+ years' experience in a product or process development or production environment
Preferred
Desired: experience in complex printed circuit board and/ or GPU board manufacturing
Using design tools and software packages
Strong analytical and problem solving skills
Designing mechanical tooling and associated algorithms
Using empirical analysis, modelling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management
Knowledge of different issue resolution methods (e.g., 8D, CLCA, etc.) and how to effectively implement
Ability to broadly contribute in a fast-paced, industrial R&D environment
Excellent communication and teamwork skills
Excellent planning, organizational, and documentation skills
Ability to give clear and effective presentations to inform and persuade peers and managers
Benefits
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave
Company
HP is a manufacturer and seller of personal computers, printers, computer hardwares, and business solutions.
10001+ employees
H1B Sponsorship
HP has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (193)
2024 (187)
2023 (190)
2022 (200)
2021 (178)
2020 (183)
Funding
Current Stage
Public CompanyTotal Funding
$5.25BKey Investors
U.S. Department of CommerceBerkshire Hathaway
2025-04-14Post Ipo Debt· $1B
2024-08-27Grant· $50M
2022-04-06Post Ipo Equity· $4.2B
Leadership Team
Alex Paranicas
Senior Director, Corporate Strategy
Andrew Bolwell
Chief Disrupter and Global Head of HP Tech Ventures
Recent News
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