W3Global · 8 hours ago
Semiconductor Package Engineer
Bethlehem, PA
Full-time
Onsite
Mid, Senior Level
2+ years expW3Global is breaking the boundaries of the Power Semiconductor space by developing cutting-edge technologies for silicon power products. They are seeking a Semiconductor Package Engineer to lead package technology development and collaborate on new product definitions and introductions.
ConsultingRecruitingStaffing Agency
Responsibilities
Work as part of a cross-functional team of Design, Applications, Marketing, Quality, and Operations engineers
Propose and develop ideas for new packaging solutions and systems/infrastructure enhancements
Collaborate on Design of Experiments to determine optimum processes, materials, and product solutions
Lead thermal and thermo-mechanical modeling capability development and implementation
Expand knowledge and experience in power semiconductor technologies
Create Intellectual Property (IP) and actively participate in the IP Program
Qualification
Required
MS or PhD in Mechanical Engineering, Material Science, or related degree
Extensive experience with thermal or thermo-mechanical simulation and modeling tools
In-depth understanding of semiconductor packaging, processes, and materials
Team player with a positive attitude and strong program management skills
Ability to work effectively with cross-functional teams and thrive in a dynamic, fast-paced environment
Preferred
2+ years of experience in power semiconductor device package design and development
Working knowledge of industry standard power packages such as TO, DFN/QFN, TOLL, and power modules
Thorough understanding of package design, package assembly processes, and material interactions
Experience working with OSAT suppliers on package development and new product introduction
Good understanding of JEDEC specifications and application to component-level reliability and qualification requirements
Knowledge of statistical analysis and design of experiments
Demonstrated ability to manage multiple tasks outside the traditional scope of packaging engineering-such as subcontractor management, creating operational build plans, failure analysis definition, and supporting cross-functional initiatives
Company
W3Global
W3Global is a leading provider of end-to-end consulting services, empowering businesses to achieve their strategic goals and optimize their operations.
501-1000 employees
H1B Sponsorship
W3Global has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (14)
2024 (7)
2023 (12)
2022 (12)
2021 (13)
2020 (33)
Funding
Current Stage
Late StageLeadership Team
Sridhar Venkatesan
CEO
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