Quantinuum · 11 hours ago
Sr. Advanced Semiconductor Packaging Engineer - 653
Broomfield, CO
Full-time
Hybrid
Senior Level
$129K/yr - $161K/yr
5+ years expQuantinuum is the world leader in quantum computing, and they are seeking a Sr. Advanced Semiconductor Packaging Engineer to develop innovative packaging schemes for ion traps in their quantum computers. This role will involve collaboration with various designers and vendors to prototype and fabricate ion trap assemblies.
Cyber SecurityQuantum ComputingSoftware Engineering
No H1B
U.S. Citizen Only
Responsibilities
Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps
Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
Work with vendors to implement and validate packaging processes
Support all stages of ion trap development to ensure compatibility with packaging
Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
Engage with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities
Qualification
Required
Bachelor's degree minimum
5+ years of experience in an engineering or R&D environment
3+ years' experience in advanced semiconductor packaging development
Due to Contractual requirements, must be a U.S. Person defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen
Preferred
PhD in Physics or Engineering
7 years' experience with advanced large area multi-chip semiconductor packaging technologies
5 years' experience with large heterogeneous integration and 2.5-3D packaging techniques
5 years' experience with high-density I/O technologies
Experience with photonic packaging and fiber-to-chip or optical chip to optical chip coupling is a plus
A proven track record of innovation and IP development
Experience working within a cross-functional team environment
Benefits
Flexible work schedule
Employer subsidized health, dental, and vision insurance
401(k) match for student loan repayment benefit
Equity, 401k retirement savings plan + 12 Paid holidays and generous vacation + sick time
Paid parental leave
Employee discounts
Company
Quantinuum
Quantinuum is a IT firm that accelerates quantum computing and the development of applications across chemistry, cybersecurity, and finance. It is a sub-organization of Honeywell.
201-500 employees
Funding
Current Stage
Growth StageTotal Funding
$925MKey Investors
NVenturesJP Morgan ChaseIBM Ventures
2025-08-15Series B· $600M
2024-01-15Series A· $300M
2022-02-22Convertible Note· $25M
Leadership Team
Rajeeb Hazra
President & Chief Executive Officer
Denise Holmquist
Senior Director Product Operations
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