Kulicke & Soffa · 12 hours ago
Senior Field Application Engineer
Fort Washington, PA
Full-time
Onsite
Mid, Senior Level
2+ years expKulicke & Soffa is a company focused on semiconductor device packaging technologies, and they are seeking a Senior Field Application Engineer. This role involves developing advanced packaging process solutions, testing and maintaining packaging assembly equipment, and providing technical support to customers.
Electrical DistributionElectronicsIndustrialManufacturingSemiconductor
Hiring Manager
Gregorio Serrao
Responsibilities
Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing
Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
Identifies, analyzes and resolves system design weaknesses
This position requires extensive traveling to visit multiple US-based customers (up to 75%), The work is often performed in a cleanroom environment which requires wearing cleanroom suit
Qualification
Required
Bachelors or Masters Degree (Masters preferred) in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging
2+ years of experience in a related field
Knowledge of the semiconductor packaging is a plus
Hands-on, strong aptitude and deep understanding of highly advanced machinery
Strong data analysis skills
Ability to travel within the US, up to 75% of the time
Preferred
Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) highly preferred
Candidates with higher qualifications may be considered for a more senior position
Company
Kulicke & Soffa
Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets.
1001-5000 employees
H1B Sponsorship
Kulicke & Soffa has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (14)
2024 (29)
2023 (14)
2022 (11)
2021 (23)
2020 (12)
Funding
Current Stage
Public CompanyTotal Funding
unknown1978-01-13IPO
Leadership Team
Lester Wong
General Counsel, Senior Vice President, Legal Affairs
Recent News
2026-01-06
2025-11-22
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