Arm · 1 week ago
Staff Multi-Die (3DIC/2.5D) CAD & Methodology Engineer
San Diego, CA
Full-time
Hybrid
Lead/Staff
$191K/yr - $258K/yrArm is seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. The role focuses on building robust, scalable, and production-ready flows in collaboration with various teams to enhance the design process.
AnalyticsElectronicsInternet of ThingsSemiconductorSoftware
Responsibilities
Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies
Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout
Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management
Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows
Develop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategies
Enable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systems
Define guidelines for ESD verification in advanced packaging contexts
Assist with tool qualification, correlation, and signoff criteria definition
Develop and support thermal analysis methodologies for 3DIC and 2.5D designs
Enable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to system
Support coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysis
Partner with design and package teams to incorporate thermal considerations early in the design flow
Build and maintain automation, scripts, and checks to improve flow robustness, runtime, and usability
Develop documentation, examples, and training materials for design teams
Debug flow issues and provide CAD support during active design cycles
Drive continuous improvement based on user feedback and silicon takeaways
Work closely with physical design, package, PI, reliability, and silicon teams
Collaborate with EDA vendors to evaluate new tools, features, and roadmap items
Support tool upgrades, regressions, and flow migrations across projects
Qualification
Required
Strong hands-on experience with 3DIC and/or 2.5D designs
Familiarity with chiplet-based designs, system-in-package designs and tradeoffs involved
Preferred
Experience with TSVs, micro-bumps, interposers, and advanced packaging technologies
Familiarity with industry-standard EDA tools for 3DIC implementation and signoff
Cadence Integrity 3D-IC
Synopsys 3DIC Compiler
Cadence Celsius Thermal Solver (including CFD-based thermal analysis)
Ansys Icepak
Ansys RHSC-ET
Company
Arm
Arm’s foundational technology is defining the future of computing. A future built by the greatest technology ecosystem in the world.
Founded in 1990
5001-10000 employees
H1B Sponsorship
Arm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (295)
2024 (166)
2023 (164)
2022 (123)
2021 (103)
2020 (133)
Funding
Current Stage
Public CompanyTotal Funding
unknown2016-07-18Acquired
1999-01-15IPO
Leadership Team
Rene Haas
Chief Executive Officer
Jason Child
EVP and Chief Financial Officer
Recent News
2026-01-22
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2026-01-22
2026-01-19
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