Intern, AI/ML applied to Wireless Communications jobs in United States
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InterDigital, Inc. · 20 hours ago

Intern, AI/ML applied to Wireless Communications

InterDigital is a global research and development company focused primarily on wireless, video, artificial intelligence, and related technologies. The role involves developing AI and ML applications for wireless communications, where interns will work on innovative projects and contribute to leading conferences.

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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Develop proof-of-concepts, prototypes and research ideas that tie machine learning and AI technologies with a broad range of signal processing and wireless technologies
Push state of the art in AI/ML for signal processing and wireless communication
Formulate and solve real-world problems using non-convex, stochastic, and combinatorial optimization
Research and design of ML algorithms that will be at the core of next generation (6G) wireless communication systems

Qualification

Machine LearningDeep LearningOptimizationWireless CommunicationSignal ProcessingPytorchTensorflowResearch ExperiencePublications

Required

Ph.D. student in EE, Computer Science, Statistics, or relevant discipline
Publications or research and development experience in one or more of the following areas: machine learning, deep learning, data mining, optimization
Hands on experience with ML frameworks such as Pytorch, Tensorflow

Preferred

Background in wireless communication and/or signal processing is a plus, but not necessary

Benefits

We promote long-lasting collaborations with our interns.
Publish in leading conferences including NeurIPS, ICLR, IJCAI, ICASSP, INFOCOM, SIGCOMM, GLOBECOM.
Opportunity to collaborate with leading researchers in their fields.

Company

InterDigital, Inc.

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InterDigital develops mobile and video technologies at the core of devices, networks, and services worldwide.

H1B Sponsorship

InterDigital, Inc. has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (5)
2023 (7)
2022 (8)
2021 (20)
2020 (2)

Funding

Current Stage
Public Company
Total Funding
$675M
2019-05-30Post Ipo Equity· $400M
2015-03-06Post Ipo Debt· $275M
1981-11-20IPO

Leadership Team

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Lawrence Chen
President and CEO
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Henry Tirri
CTO, Executive Vice President of Research & Development
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Company data provided by crunchbase